Resin-Molded Motor Substrate Layout for Protected Conductive Pads
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Solution Overview
Problem
Existing motors require improved molding techniques to ensure proper integration and protection of components while maintaining electrical connectivity and aesthetic appeal.
Innovation Solution
A motor design featuring a substrate with conductivity pads and recessed parts surrounding them, covered by a resin member, which is molded to prevent resin protrusion and ensure electrical connections are maintained.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is covered with resin member to protect components and improve appearance, then protection and aesthetic appeal are improved, but resin may protrude into critical areas causing molding defects
Solution Approach 1:
The recessed part is formed on the substrate surface before the resin member is molded, in advance preventing resin protrusion into critical areas. This preliminary structural preparation ensures that when resin is injected during molding, it naturally stops at the recessed part boundary without requiring complex mold designs or post-processing.
Solution Approach 2:
The recessed part is strategically positioned only at specific locations where pads are located, creating local structural differentiation. This allows the substrate to have different properties in different regions: flat areas allow resin coverage for protection, while recessed areas prevent resin intrusion into critical electrical connection zones.
Data Source
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AI summary
An object is to provide an appropriately molded motor. A motor (1) includes a stator (20), a substrate (30) supported by the stator (20), and a resin member (50) covering the stator (20), the substrate (30) includes, in an axial direction, a first surface (30F) opposing the stator (20) and a second surface (30S) at an opposite side from the first surface (30F), the first surface (30F) of the substrate (30) is in contact with the resin member (50), the second surface (30S) of the substrate (30) includes an inner peripheral part (30i), an outer peripheral part (30o), and an intermediate part (30m) located between the inner peripheral part (30i) and the outer peripheral part (30o), the intermediate part (30m) is provided with at least one pad (40) having conductivity and is formed with a recessed part (45) surrounding the pad (40), and an end part of the recessed part (45) in a radial direction is formed at an outer side (d) in the radial direction of the inner peripheral part (30i) and at an inner side (c) in the radial direction of the outer peripheral part (30o).