Mould Plate Temperature Distribution Calculation Using Sensor Correction

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Solution Overview

Problem

Conventional thermocouple technology for monitoring temperature distribution in metal-making moulds is inadequate for complex geometries and topologies, as it fails to accurately account for mould geometry and cooling arrangements, leading to incomplete thermal monitoring and potential defects like breakouts and inhomogeneous solidification.

Innovation Solution

A method using a dense array of fibre optical sensors, where temperature values from sensors are corrected using linear or non-linear functions based on simulated mould plate models and thermal boundary conditions to estimate temperature distribution at reference points, providing a more accurate thermal picture of the mould plate and indirectly the cast metal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional thermocouple technology is used with coarse arrangement, then device complexity is reduced, but measurement precision deteriorates due to inability to accurately capture temperature distribution in complex mould geometries

Engineering Contradiction:
Improvetemperature distribution measurement precisionVSAvoidsensor array complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The mould plate is divided into multiple measurement zones with thermocouples arranged in a dense grid pattern, allowing localized temperature measurement in complex geometry regions. Each sensor measures temperature at its specific location, and the collective data provides comprehensive thermal distribution information that coarse arrangements cannot capture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent replaces conventional mechanical thermocouple arrangements with a integrated sensor array embedded in the mould plate structure. The sensors are systematically positioned to account for complex geometries and cooling arrangements, substituting simple coarse placement with a structured measurement system that inherently adapts to the mould's thermal characteristics.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If thermocouples are positioned away from cooling channels to accommodate bolts, then ease of manufacture is improved, but measurement precision deteriorates due to increased distance from heat transfer zones

Engineering Contradiction:
Improvemould plate assembly easeVSAvoidtemperature measurement accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent positions thermocouples at multiple depth levels within the mould plate thickness, not just at the surface. This vertical dimensionality allows sensors to be placed closer to cooling channels and heat transfer zones without interfering with bolt arrangements at the surface, capturing temperature gradients through the plate thickness that single-level arrangements miss.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Different regions of the mould plate have thermocouples positioned at different depths and locations optimized for local thermal conditions. Areas with high heat flux have sensors closer to the hot face, while regions near cooling channels have sensors positioned to capture the thermal gradient, creating locally optimized measurement points that maintain both manufacturing feasibility and measurement accuracy.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If symmetric arrangement of thermocouples between cooling channels is used, then ease of manufacture is improved, but measurement precision deteriorates due to inability to detect asymmetric thermal events

Engineering Contradiction:
Improvesensor positioning easeVSAvoidthermal event detection precision
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent deliberately employs asymmetric thermocouple arrangements in regions where asymmetric thermal events are expected, such as near tapered sections or irregular cooling channel layouts. The sensor positions are optimized to detect thermal gradients and events that symmetric arrangements would miss, while maintaining overall systematic coverage for manufacturing feasibility.

Inventive Principle:
Principle #4Asymmetry

4Measurement precision

If dense array of temperature sensors is implemented, then measurement precision is improved, but device complexity increases due to complex data processing requirements for accurate hot face temperature monitoring

Engineering Contradiction:
Improvehot face temperature measurement precisionVSAvoiddata processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent pre-calculates and stores correction factors and transfer functions during the design phase, based on thermal finite element models of the specific mould geometry. These pre-computed parameters are embedded in the system, allowing real-time temperature monitoring to use simple lookup and calculation operations rather than complex iterative thermal analysis, thus reducing online data processing complexity while maintaining high measurement precision.

Inventive Principle:
Principle #10Preliminary action

5Reliability

If thermocouples are placed in drilled holes in the copper plate, then reliability is improved, but manufacturing precision deteriorates due to additional drilling operations and potential sensor misalignment

Engineering Contradiction:
Improvesensor mounting reliabilityVSAvoidsensor position precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent integrates thermocouple mounting features directly into the mould plate manufacturing process, such as incorporating sensor recesses or mounting tabs during the same machining operations that create cooling channels and bolt holes. This merging of operations ensures precise sensor positioning relative to thermal features without requiring separate drilling and alignment steps, maintaining both reliability and manufacturing precision.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables online calculation of accurate thermal distribution in mould plates, allowing for better prediction and prevention of defects, leading to a safer, cheaper, and higher-quality metal-making process by providing detailed thermal information.

Implementation Method 1

A common breakout protection/sticker detection system consists of up to 60-100 thermocouples around the upper half of the mould

Methodology Applied
Scientific EffectThermocouple: Seebeck Effect

Implementation Method 2

the water cooling channels commonly located at the back end of the mould plate have been separated by an extra distance... Thus, the heat transfer from the hot mould surface to the cooling channels at the back end of the mould plate is, at the position of a thermocouple, directed perpendicular to the hot mould surface

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP3601969B1Method and device for determining a temperature distribution in a mould plate for a metal-making process
Publication Date: 2021.05.05 ABB (SCHWEIZ) AG
  • EP3601969B1 patent drawingFigure 1~2b
  • EP3601969B1 patent drawingFigure 3
  • EP3601969B1 patent drawing

AI summary

The present disclosure relates to a method of determining a temperature distribution in a mould plate of a mould for a metal-making process, wherein the method comprises:obtaining (S1) a temperature value from each of a plurality of temperature sensors arranged in the mould plate, each temperature sensor being spaced apart from a respective reference point in the mould plate,determining (S2) for each temperature value a reference point temperature value at the corresponding reference point using either a respective linear function or a respective non-linear function, wherein a correction factor and correction term of the linear function ora set of parameters in a general non-linear formulation of the non-linear function is obtained from a plurality of initial temperature relationships, wherein each initial temperature relationship is between a simulated temperature at the corresponding temperature sensor in the mould plate and a simulated temperature at the corresponding reference point in the mould plate, each simulated temperature being obtained based on a respective simulation of a model of the mould plate for a unique mouldplate condition where the thermal boundary conditions of the mould plate have beencompletely, explicitly and uniquely stated, andobtaining (S3) an estimated temperature distribution at the reference points in the mould plate by means of the reference point temperature values.