Mould Pressure Feedback for Precise Electronic Component Encapsulation

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Solution Overview

Problem

Existing encapsulating methods struggle to achieve precise control of mould closure and pressure exerted on electronic components, leading to inaccuracies in package form and potential damage, especially for vulnerable electrical contacts and components requiring precise encapsulation.

Innovation Solution

Incorporating a calibration component with a pressure sensor to directly measure the pressure exerted on the mould parts, allowing for precise control of the encapsulating process by adjusting the mould closure based on real-time feedback from the sensor, ensuring accurate pressure distribution and preventing encapsulating material from undesirably adhering to sensitive components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional encapsulating methods are used, then the encapsulation process can be completed, but the pressure control on electronic components is imprecise leading to potential damage and inaccurate package form

Engineering Contradiction:

Improvepackage form accuracyVSAvoidcomponent vulnerability to damage

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent incorporates pressure sensors that provide real-time feedback on the pressure exerted on electronic components during encapsulation. This feedback loop enables dynamic adjustment of the encapsulation process parameters to maintain pressure within safe limits while achieving precise package form, thereby resolving the contradiction between manufacturing precision and component reliability.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent uses calibration components with known mechanical properties placed alongside electronic components during encapsulation. By measuring the pressure response of these calibration components first, the system establishes a reference for safe pressure levels before actual encapsulation, preventing damage to vulnerable components while ensuring accurate package formation.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If pressure is increased to ensure complete encapsulation, then encapsulation coverage is improved, but vulnerable electrical contacts may be damaged

Engineering Contradiction:

Improveencapsulation coverageVSAvoidpressure damage to electrical contacts

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces calibration components as intermediaries between the encapsulation mold and the vulnerable electronic components. These calibration components absorb and indicate the pressure applied during encapsulation, allowing the system to achieve complete encapsulation coverage while preventing excessive pressure from damaging the electrical contacts through real-time monitoring and adjustment.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Measurement precision

If real-time pressure monitoring is implemented, then pressure control precision is improved, but device complexity increases

Engineering Contradiction:

Improvepressure measurement accuracyVSAvoidmould structure complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses calibration components that replicate the mechanical response of actual electronic components but are simpler in structure and can be easily instrumented with pressure sensors. By measuring pressure on these simplified copies rather than directly on complex electronic components, the system achieves high measurement precision while minimizing the added complexity to the encapsulation device.

Inventive Principle:

Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables precise control of mould closure and pressure, ensuring accurate encapsulation within micron-level tolerances, protecting vulnerable components and maintaining desired form and dimensions without damage or contamination.

Implementation Method 1

at least one pressure sensor is arranged in the contact side of the mould part in a manner such that the pressure which is exerted on the calibration component by the contact side of the mould part can be detected with the pressure sensor

Methodology Applied

Scientific EffectPiezoresistive effect: Piezoresistive Effect

Data Source

PatentUS20250353226A1Method and Mould for Encapsulating Electronic Components Mounted on a Carrier

Publication Date: 2025.11.20 BESI NETHERLANDS BV

AI summary

Disclosed is a method for encapsulating electronic components mounted on a carrier including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. Also disclosed is a mould for encapsulating electronic components mounted on a carrier with such a method.