Moulded Interconnect Device with Integral Legs for Circuit Substrate Mounting
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Solution Overview
Problem
Existing electronic devices face challenges in packaging and interconnecting a large number of components in a small volume, particularly in navigation systems where precise alignment and robustness are critical, while also needing to separate sensitive analog and noisy digital components, and withstand harsh environments.
Innovation Solution
The use of moulded interconnect devices with integrally formed legs and conductive tracks for efficient high-density packaging, providing alignment features and eliminating the need for mechanical spacers and connectors, while also incorporating electromagnetic shielding for robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional mechanical spacers and connectors are used to interconnect circuit boards, then assembly is straightforward with separate components, but component count increases and device volume increases
Solution Approach 1:
The patent combines multiple separate components (mechanical spacers, connectors, and support structures) into a single integrated moulded interconnect device. This mold includes integrated legs that provide both mechanical support and electrical interconnection functions, eliminating the need for separate spacers and connectors, thereby reducing component count while maintaining assembly simplicity
Solution Approach 2:
The moulded interconnect device performs multiple functions simultaneously: it provides mechanical support through integrated legs, electrical interconnection through conductive tracks, and structural spacing between circuit boards. This multi-functional design reduces the overall component count while keeping the device compact
2Area of stationary object
If pins and flexi-connectors are used for electrical connections between boards, then electrical connectivity is achieved, but board area is consumed and tooling is required for assembly
Solution Approach 1:
The patent integrates electrical conductors directly into the moulded interconnect device structure, combining the support function and electrical connection function into a single component. This eliminates the need for separate pins and flexi-connectors, freeing up board area while simplifying assembly through direct integration
Solution Approach 2:
The moulded interconnect device acts as an intermediary component that provides both mechanical support and electrical connectivity between circuit boards. The integrated legs with conductive tracks serve as a mediator that eliminates the need for traditional separate connection methods, reducing board area requirements and simplifying assembly
3Volume of moving object
If components are densely packaged in small volume, then device size is reduced, but alignment precision becomes more difficult to maintain
Solution Approach 1:
The patent employs asymmetric leg structures with specific geometries that provide inherent alignment features. The legs are designed with non-uniform dimensions and positioning that naturally guide the circuit boards into correct alignment during assembly, maintaining precision even in compact configurations
Solution Approach 2:
The moulded interconnect device incorporates self-aligning features through its integrated leg structure. The geometry of the legs and their attachment points to the circuit boards creates automatic alignment during assembly, eliminating the need for additional alignment mechanisms and maintaining precision in small-volume packaging
4Volume of moving object
If sensitive analog and noisy digital components are placed close together, then device volume is reduced, but electromagnetic interference increases
Solution Approach 1:
The patent uses the moulded interconnect device to create physical segmentation and separation between analog and digital circuit boards. The integrated legs and structural design allow for spatial separation of sensitive analog components and noisy digital components while maintaining compact overall device volume
Solution Approach 2:
The moulded interconnect device serves as an intermediary structure that physically separates and isolates analog and digital sections. The integrated design allows for electromagnetic shielding and isolation while maintaining close proximity for compact packaging, reducing electromagnetic interference between different signal types
Data Source
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AI summary
An electronic device comprises a circuit substrate, and a moulded interconnect device incorporating integral legs to mount the interconnect device upon the substrate, the legs spacing at least part of the interconnect device from the substrate, at least one of the legs carrying a conducting track to provide an electrical interconnection between the interconnect device and the substrate.