Binder-Free Mount Structure for Thermal Management
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Solution Overview
Problem
The existing mounting structures for heat-generating components face challenges with low heat dissipation due to high thermal resistance, and the use of binders like solder or adhesive increases manufacturing costs and complexity, with difficulties in repair and additional processing steps.
Innovation Solution
A mounting structure featuring a first substrate with a penetrating hole, where a second substrate and a heat dissipation element cover the hole, and a metal spring with elasticity is sandwiched between them, eliminating the need for binders and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a sub-substrate is mounted on a motherboard with a heat sink, then heat dissipation structure is provided, but thermal resistance increases due to multiple substrate layers in the heat dissipation path
Solution Approach 1:
The heat dissipation path is segmented into two separate paths: one through the motherboard for electrical connection, and another direct path through the penetrating hole for heat dissipation. This segmentation allows the heat dissipation function to be independent from the electrical connection function, reducing thermal resistance in the heat dissipation path.
Solution Approach 2:
A heat dissipation plate is introduced as an intermediary component that creates a direct thermal bridge between the heat-generating component and the heat sink. The plate fills the penetrating hole and provides a low thermal resistance path, acting as a thermal conductor while allowing electrical isolation.
2Strength
If binder materials like solder or adhesive are used to bond heat dissipation elements, then bonding is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The binder material is completely removed from the heat dissipation path. The heat dissipation plate is directly inserted into the penetrating hole and bonded only to the heat sink, eliminating the need for additional binder materials between the heat-generating component and the heat dissipation path, thereby simplifying manufacturing.
Solution Approach 2:
The heat dissipation plate itself serves as both the bonding element and the heat conduction element. Its elastic deformation provides self-bonding through elastic force, eliminating the need for separate binder materials and reducing manufacturing steps.
3Ease of manufacture
If elastic force is used to bond the heat dissipation plate, then binder-free bonding is achieved, but precise control of elastic force is required
Solution Approach 1:
The elastic properties of the heat dissipation plate are optimized by controlling material composition, plate thickness, and geometric shape. These parameter changes ensure that the elastic force is sufficient for bonding while remaining controllable during assembly, achieving a balance between ease of manufacture and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal resistance, lowers manufacturing costs, simplifies the process, and allows for easier repair by bonding the heat sink and sub-substrate directly without binders, enhancing the heat dissipation effect.
Implementation Method 1
a second heat dissipation element sandwiched and attached between the second substrate and the first heat dissipation element inside the penetrating hole, wherein the second heat dissipation element is a metal spring having elasticity in the substrate thickness direction
Implementation Method 2
the motherboard 110 and the sub-substrate 120 are interposed in a heat dissipation path extending from the heat generating component 140 to the heat sink 130
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Provided is a mounting structure that can bond a first heat dissipation element to a second substrate through a hole in a first substrate without using a binder such as solder, an adhesive, or the like. A mounting structure of the present disclosure includes a first substrate (10) in which a penetrating hole (11) is formed, a second substrate (20) and a first heat dissipation element (30) overlapped with both surfaces of the first substrate (10), respectively, so as to cover the penetrating hole (11), and a second heat dissipation element (40) sandwiched and attached between the second substrate (20) and the first heat dissipation element (30) inside the penetrating hole (11).