Electronic-Component Mount Substrate Heat Dissipation via Outer Electrode Segmentation

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Solution Overview

Problem

In electronic-component mount substrates, heat generated from electronic components and via conductors can concentrate at the center, leading to potential warping and separation or breakage of the substrate, especially as devices become smaller and more advanced.

Innovation Solution

The substrate design includes a mount electrode with a slit, a surrounding plane electrode with a slit, and a connection electrode that overlaps the outer electrode, with the outer edge of the outer electrode surrounding the connection electrode, allowing heat to be transferred to the outer electrode rather than the connection electrode, thereby reducing substrate warping and component separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the via conductor is connected to the mount electrode and overlaps a mount portion for the electronic component in a perspective plan view, then electrical connection is achieved, but heat generated from the via conductor and electronic component concentrates at the center portion of the substrate, causing substrate warping and component separation or breakage

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidheat concentration causing substrate warping

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The outer electrode is divided into a connection electrode (connected to the via conductor) and a plane electrode (surrounding the mount electrode). This segmentation separates the heat transfer path, directing heat away from the mount electrode and electronic component toward the plane electrode, thereby reducing heat concentration at the substrate center while maintaining electrical connection reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different functional qualities to different parts of the electrode structure. The connection electrode is optimized for electrical connection with the via conductor, while the plane electrode is optimized for heat dissipation. This local differentiation allows the system to achieve both reliable electrical connection and effective heat management without compromising either function.

Inventive Principle:

Principle #3Local quality

2Productivity

If the device size is decreased to meet miniaturization requirements, then productivity and portability improve, but heat concentration and substrate warping become more severe

Engineering Contradiction:

Improvedevice miniaturization capabilityVSAvoidheat concentration severity

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a conventional linear electrode arrangement to a planar configuration where the plane electrode surrounds the mount electrode in a two-dimensional layout. This dimensional change allows heat to be dissipated across a larger area relative to the compact device size, effectively managing heat concentration in miniaturized devices without compromising electrical connection.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses heat transfer to the electronic component through the connection electrode, reducing the likelihood of substrate warping and component separation, thereby enhancing electrical reliability and long-term module reliability.

Implementation Method 1

transfer of heat of the via conductor by a large amount to the electronic component through the connection electrode is suppressed, and the heat is more likely transferred to the outer electrode rather than the connection electrode

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10334740B2Electronic-component mount substrate, electronic device, and electronic module

Publication Date: 2019.06.25 KYOCERA CORP

AI summary

An electronic-component mount substrate includes a substrate having a first principal surface and a second principal surface opposite to the first principal surface; a mount electrode for mounting an electronic component on the first principal surface, the mount electrode having a first slit and sandwiching the first slit; a plane electrode surrounding the mount electrode in a plan view and having a second slit; a connection electrode connecting the mount electrode with the plane electrode; and an outer electrode on the second principal surface. The connection electrode overlaps the outer electrode and an outer edge of the outer electrode surrounds the connection electrode in a perspective plan view.