Mounter Suction Posture Inspection Using Dynamic Image Processing
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Solution Overview
Problem
Conventional mounters face challenges in accurately processing the pickup orientation of small electronic components due to their limited field of view and resolution, leading to unreliable position correction and mounting accuracy.
Innovation Solution
The mounter employs an image processing pattern selecting section that adjusts image processing accuracy and range based on component size, using a combination of caliper tools and binarization methods to ensure accurate processing of small components while minimizing processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the head-side imaging device is used for small electronic components, then the imaging time is short, but the image processing accuracy deteriorates
Solution Approach 1:
The system dynamically switches between two imaging devices based on component size. The head-side imaging device is used for large components where speed is prioritized, while the base-side imaging device is activated for small components requiring high accuracy. This dynamic selection resolves the contradiction by matching the imaging device characteristics to the specific requirements of each component size category.
Solution Approach 2:
Different imaging devices are applied to different regions of the workspace based on component size. The head-side imaging device serves the region for large components, while the base-side imaging device serves the region for small components. This spatial differentiation of imaging quality allows the system to optimize both speed and accuracy in their respective domains without compromise.
2Measurement precision
If higher image processing accuracy is applied, then the measurement precision improves, but the image processing time increases
Solution Approach 1:
The system changes the imaging parameters by selecting different imaging devices with distinct characteristics. The head-side imaging device provides faster processing with lower accuracy suitable for large components, while the base-side imaging device provides higher accuracy with longer processing time suitable for small components. This parameter change allows optimization of the accuracy-time trade-off based on component size.
Solution Approach 2:
For small components, the system applies excessive action by using the base-side imaging device with high accuracy processing, even though it increases processing time. This is justified because the criticality of accurate measurement for small components outweighs the time penalty, whereas for large components the system uses minimal necessary action (head-side device) to maintain efficiency.
Data Source
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AI summary
It is possible to perform appropriately accurate image processing of various sizes of electronic components, while curtailing an increase in the image processing time. A mounter is provided with a head unit with a suction nozzle capable of picking up an electronic component that transfers the electronic component to a specified position, an imaging device that images the pickup orientation of the electronic component, a component data acquiring device that acquires the size of the electronic component, an image processing section that image processes the captured image, and an image processing pattern selecting section. The image processing pattern selecting section, based on the size of the electronic component, is able to select one image processing range and one image processing accuracy from multiple predetermined image processing ranges and multiple predetermined printing accuracies, and, as the size of the electronic component acquired from the component data acquiring section becomes smaller, selects a smaller image processing range and a more accurate image processing accuracy from the multiple image processing ranges and multiple image processing accuracies. The image processing section performs image processing according to the image processing range and the accuracy selected by the image processing pattern selecting section.