Mounting Accuracy Measurement Chip Protrusion Design
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Solution Overview
Problem
Existing mounting accuracy measurement kits face challenges in achieving high accuracy due to adhesiveness issues, making it difficult to detach the measurement chip from the placement portion after measurement, and errors occur when the chip's surface is not parallel to the substrate.
Innovation Solution
The mounting accuracy measurement chip features protrusions on its mounting face, positioned within a circular range centered at the chip's center of gravity and half the length of its longest distance to the edge, allowing only these protrusions to contact the substrate, improving measurement accuracy and ease of detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the entire lower surface of the chip is made to contact the substrate for mounting, then the mounting stability is improved, but the measurement accuracy deteriorates due to parallelism errors between the chip surface and substrate
Solution Approach 1:
The patent extracts the contact function from the entire chip lower surface and concentrates it to only the protrusions. The protrusions are the only parts that contact the substrate, while the rest of the chip lower surface is elevated and does not contact. This extraction resolves the contradiction by eliminating the parallelism error source (the large contact area) while maintaining the necessary contact function through the protrusions.
Solution Approach 2:
The patent applies local quality by creating different functional zones on the chip lower surface: the protrusions have contact functionality while the surrounding areas do not. The protrusions are strategically positioned within a circular range centered at the chip's center of gravity, creating a localized contact region that ensures both stability and measurement accuracy.
2Stability of the object's composition
If the chip is made to adhere completely to the placement portion for secure positioning, then the positioning stability is improved, but the ease of detachment deteriorates
Solution Approach 1:
The patent extracts the adhesion function from the entire chip lower surface and concentrates it to only the protrusions. Since only the protrusions contact the placement portion, the adhesion area is dramatically reduced. This allows the chip to be securely positioned during measurement while enabling easy detachment, as the reduced contact area minimizes the adhesive force that needs to be overcome for removal.
3Manufacturing precision
If protrusions are provided outside the central circular range, then additional contact points are available, but measurement accuracy deteriorates due to increased leverage and positional errors
Solution Approach 1:
The patent applies local quality by restricting protrusions to a specific spatial zone - within a circular range centered at the chip's center of gravity with radius equal to half the longest distance from center to edge. This localized arrangement ensures that all contact points are close to the center of gravity, minimizing leverage effects and positional errors, while still providing sufficient contact points for stability.
Solution Approach 2:
The patent uses asymmetric positioning relative to the chip geometry by defining the protrusion placement zone based on the center of gravity rather than geometric center or edge-based coordinates. This asymmetric approach optimizes the contact point distribution for measurement accuracy by anchoring the contact region to the physical balance point of the chip.
Data Source
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AI summary
A mounting accuracy measurement chip comprises: chip main body 80; and one or more protrusions 81, 82, 83, 84, provided on a mounting face of chip main body 80, which serve as a contact surface with a mounting target at a position shifted from the mounting face of chip main body 80; wherein the one or more protrusions 81, 82, 83, 84 are disposed only within a range defined by a circle whose center is center of gravity G of the mounting face and whose radius is half the length of the longest distance L1 from center of gravity G to the outer edge of chip main body 80. Further, a mounting accuracy measurement kit comprises: the above-mentioned mounting accuracy measurement chip 64 and placement portion 100, having a degree of adhesiveness, to which the contact surface of mounting accuracy measurement chip 64, which can be placed, adheres.