Semiconductor Mounting Apparatus with Pre-Attachment Element Measurement
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Solution Overview
Problem
In the production of semiconductor devices, existing mounting apparatuses face challenges in accurately attaching diverse elements to predetermined positions on substrates, such as printed circuit boards, due to the need for precise alignment and measurement of element values, which can lead to defects if not done correctly.
Innovation Solution
A mounting apparatus is designed with a frame, a feeder unit, an element value measuring unit, and a control device that works in conjunction with a head unit to pick up and attach elements to substrates, ensuring accurate placement based on design information and allowing for real-time measurement and comparison of element values against predetermined criteria.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If elements are attached to substrates based on PCB design information using existing mounting apparatuses, then semiconductor devices can be produced, but alignment precision and measurement accuracy may be compromised leading to defects
Solution Approach 1:
The patent applies preliminary action by measuring element values before attachment to the substrate. The mounting apparatus includes a measurement unit that detects element characteristics (resistance, capacitance, inductance) prior to mounting, ensuring that only elements meeting specification criteria are attached. This pre-measurement step prevents defective elements from being mounted, thereby improving reliability without compromising alignment precision.
Solution Approach 2:
The patent implements feedback by using measurement results to control the attachment process. The system compares measured element values against predetermined criteria and uses this feedback information to determine whether to proceed with attachment. The control unit receives measurement data and adjusts the mounting process accordingly, ensuring that alignment precision is maintained while preventing defects through intelligent decision-making based on real-time measurement feedback.
2Adaptability or versatility
If diverse elements of different types and values are mounted on substrates, then functional requirements are met, but measurement and alignment complexity increases
Solution Approach 1:
The patent applies universality by designing a single measurement unit capable of measuring multiple element types (resistors, capacitors, inductors) with different values. The measurement unit can detect various electrical characteristics across different element categories, and the control unit processes diverse measurement results using unified criteria. This multi-functional approach allows the system to handle element diversity without proportionally increasing measurement complexity.
Solution Approach 2:
The patent uses parameter changes by adjusting measurement thresholds and criteria based on element type and value. The system dynamically modifies measurement parameters (such as resistance ranges, capacitance values, inductance thresholds) according to the specific element being measured. This allows the apparatus to adapt to diverse elements while maintaining consistent measurement complexity through automated parameter adjustment rather than requiring separate complex measurement systems for each element type.
3Manufacturing precision
If element values are measured and compared against predetermined criteria before attachment, then attachment accuracy improves, but processing time increases
Solution Approach 1:
The patent applies preliminary action by performing rapid measurements of element values immediately before attachment. The measurement unit quickly detects element characteristics and the control unit rapidly compares these values against predetermined criteria stored in memory. This pre-verification process ensures attachment accuracy by confirming element specifications before mounting, while the automated nature of the measurement and comparison minimizes the time added to the process.
Solution Approach 2:
The patent implements continuity of useful action by integrating the measurement and attachment processes into a seamless workflow. The measurement unit operates continuously as elements are fed to the mounting apparatus, and the control unit continuously compares measurement results against criteria without interrupting the overall mounting rhythm. This continuous operation minimizes idle time and ensures that the measurement step becomes an efficient part of the attachment process rather than a separate time-consuming operation.
Data Source
AI summary
A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.