Mounting Apparatus for Non-Standard Components in Modular Data Centers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heterogeneous data center environments face challenges in scalability and resource-intensive engineering due to the lack of configuration options for cooling, power, and IT components, particularly for non-compatible components that require redesign for pre-integration.
Innovation Solution
A mounting apparatus is provided to pre-integrate non-compatible components into a modular data center (MDC) without redesigning them, allowing for flexibility in integrating both compatible and non-compatible components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are designed with fixed configuration options (one-size-fits-all), then manufacturing and deployment are simplified, but adaptability to heterogeneous data center environments is reduced
Solution Approach 1:
The mounting apparatus is divided into multiple adjustable positioning elements that can be independently configured. Each positioning element can be adjusted to different positions along the rack structure, allowing the same mounting apparatus to accommodate components of various sizes and shapes without requiring custom-designed mounting solutions for each component type.
Solution Approach 2:
The mounting apparatus incorporates adjustable and reconfigurable elements that can be dynamically positioned to match different component dimensions. The positioning mechanisms allow for flexible adjustment during installation, enabling the same mounting structure to adapt to heterogeneous components rather than requiring fixed, component-specific mounting designs.
2Adaptability or versatility
If custom solutions are designed for specific customer demands, then adaptability to specific requirements is improved, but resource-intensive engineering efforts are required
Solution Approach 1:
The mounting apparatus is designed as a universal mounting solution that can accommodate multiple types of components (cooling, power, and IT components) with a single device design. The adjustable positioning elements and standardized mounting interfaces allow the same apparatus to fulfill different customer requirements without requiring custom engineering for each specific application.
Solution Approach 2:
The mounting apparatus utilizes adjustable parameters such as positioning locations, mounting heights, and configuration settings that can be modified to meet specific customer demands. By changing these parameters rather than redesigning the entire mounting solution, the system achieves adaptability while minimizing engineering resource requirements.
3Adaptability or versatility
If non-compatible components are integrated without mounting points, then component compatibility is improved, but pre-integration capability is reduced
Solution Approach 1:
The mounting apparatus serves as an intermediary between the rack structure and non-compatible components that lack standard mounting points. The apparatus includes adaptive mounting mechanisms such as adjustable brackets, clamps, or positioning elements that can interface with various component forms factors, enabling pre-integration of components that would otherwise be incompatible with standard rack mounting systems.
Data Source
AI summary
A modular data center includes: a modular information technology component (MITC), in which the MITC comprises a cooling distribution unit (CDU), a floor, a bottom cooling distribution unit mounting component (CDUMC), a modular over-rack component (MORC), and a top CDUMC, in which the floor comprises a floor track apparatus (FTA), in which the bottom CDUMC affixes the CDU to the FTA, in which the top CDUMC affixes the CDU to the MORC, in which the top CDUMC provides air containment with an internal environment of the MITC; and a modular environmental control component (MECC), in which the MECC comprises a plurality of environmental control components (ECCs) and built-in airflow connection components, in which the built-in airflow connection components remove and supply air to the MITC.