Mounting Apparatus Reaction Force Management
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Solution Overview
Problem
Conventional mounting apparatuses face issues with poor mounting accuracy due to inclination of the mounting head and pressurizing mechanism, and increased size and cost due to the need for a moving substrate stage, especially when the pressurizing mechanism is fixed and the substrate is larger than the mounting head.
Innovation Solution
A mounting apparatus with a movable pressurizing mechanism attached to a first base and a pressure receiving member independently positioned to receive reaction forces, allowing the mechanism to move horizontally with the mounting head and eliminating the need for a substrate moving mechanism, thus maintaining accuracy and reducing apparatus size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pressurizing mechanism is attached to the horizontally movable body in an offset manner to save space, then the apparatus size is reduced, but the mounting head becomes inclined due to reaction forces, resulting in poor mounting accuracy
Solution Approach 1:
The pressurizing mechanism is separated from the mounting head into an independent component. The reaction force receiving structure is provided independently on the horizontally movable body, while the pressurizing mechanism is attached to the vertically movable body. This segmentation allows the pressurizing mechanism to be positioned centrally without offset, eliminating inclination moments while maintaining compact apparatus size.
Solution Approach 2:
A reaction force receiving structure (intermediary component) is introduced between the pressurizing mechanism and the horizontally movable body. This intermediary structure receives the reaction force generated during pressing operations, preventing it from being transmitted to the mounting head and causing inclination. The intermediary absorbs the harmful reaction forces while allowing the pressurizing mechanism to maintain proper alignment.
2Manufacturing precision
If the pressurizing mechanism is attached to a fixed member to maintain stability, then mounting accuracy is improved, but the substrate stage must be moved, increasing the apparatus size and cost
Solution Approach 1:
The pressurizing mechanism is made dynamically movable by attaching it to the vertically movable body instead of a fixed member. This allows the pressurizing mechanism to move horizontally together with the mounting head, eliminating the need for a movable substrate stage. The dynamic configuration maintains mounting accuracy through proper force reception while reducing apparatus size.
Solution Approach 2:
Instead of moving the substrate stage (traditional approach), the invention inverts the approach by making the pressurizing mechanism movable with the mounting head. This inversion transfers the movement function from the substrate stage to the pressurizing mechanism, reducing the need for large substrate stage movement capabilities and thereby reducing apparatus size.
3Ease of operation
If the mounting head is pressed vertically to mount components, then mounting function is achieved, but reaction forces cause inclination of the pressurizing mechanism and mounting head, reducing mounting accuracy
Solution Approach 1:
The reaction force, which was previously a harmful factor causing inclination, is converted into a beneficial element by providing a dedicated reaction force receiving structure. This structure is designed to specifically receive and accommodate the reaction force generated during pressing operations, converting the harmful inclination moment into a controlled force transmission path that does not affect mounting accuracy.
Data Source
AI summary
A mounting apparatus includes a Y-axis movable base 36 movable in a Y-axis direction, a Z-axis movable base 40 attached to the Y-axis movable base 36 and movable in a Z-axis direction, a mounting head 12 attached to the Z-axis movable base 40 and including a mounting tool 16 for sucking and holding a semiconductor chip, a pressurizing mechanism 20 attached to the Y-axis movable base 36 and arranged to apply a force in the Z-axis direction to the mounting head 12, and a pressure receiving member 22 provided independently of the Y-axis and Z-axis movable bases 36 and 40 and installed in proximity to the pressurizing mechanism 20 to receive a reaction force in the Z-axis direction from the pressurizing mechanism 20, the pressurizing mechanism 20 slidable on the pressure receiving member 22. This prevents the mounting apparatus from being increased in the total size while maintaining the mounting accuracy high.