Mounting Base With Integrated Evaporator and Condenser Channels
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Solution Overview
Problem
Existing mounting bases for electric components suffer from uneven heat distribution, leading to inefficient heat dissipation and potential damage due to pressure buildup in thermosyphon or planar heat pipe systems.
Innovation Solution
The integration of evaporator and condenser channels within the mounting base allows for fluid circulation, ensuring even heat distribution and dissipation without the need for pumps, using gravity and phase changes to facilitate fluid movement and prevent bulging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermosyphon or planar heat pipe is used for distributing heat, then heat distribution in all directions is achieved, but pressure inside increases causing mounting base to bulge and damage components
Solution Approach 1:
The patent changes the physical state parameters of the working fluid by establishing distinct evaporator and condenser channels with different temperature zones. The evaporator channel receives heat from the component and vaporizes the fluid, while the condenser channel condenses the vapor back to liquid, creating a controlled parameter change cycle that distributes heat without excessive pressure buildup.
Solution Approach 2:
The patent utilizes phase transitions of the working fluid between liquid and vapor states. In the evaporator channel, the fluid absorbs heat and transitions from liquid to vapor. In the condenser channel, the vapor releases heat and transitions back to liquid. This phase transition mechanism enables efficient heat distribution while regulating internal pressure.
2Productivity
If heat load is very local on the first surface, then only a part of the surface area is affected, but the entire dissipation capacity of the second surface cannot be efficiently utilized
Solution Approach 1:
The patent introduces a working fluid as an intermediary substance that circulates through evaporator and condenser channels. The fluid absorbs heat locally at the evaporator where the component is mounted, then transports this heat through the channel system to the condenser, which is positioned at the second surface. This intermediary mechanism enables the entire second surface to participate in heat dissipation even when the heat load is localized.
Solution Approach 2:
The patent employs a fluid-based heat transport system using evaporator and condenser channels. The working fluid circulates through these channels, carrying thermal energy from the local heat source at the first surface to the dissipation area at the second surface. This hydraulic/pneumatic approach enables efficient heat redistribution across the entire surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation across the entire surface of the mounting base, preventing damage to attached components and maximizing cooling capacity while maintaining structural integrity.
Implementation Method 1
evaporator channels (7) arranged in the vicinity of the first surface (2) to receive the heat load from the electric component (3) via the first surface (2), and to pass the heat load into the fluid in the evaporator channels (7)
Implementation Method 2
condenser channels (8) arranged in the vicinity of the second surface (4) to transfer heat from the fluid in the condenser channels (8) to the second surface (4)
Implementation Method 3
a mounting base with improved capabilities of conducting heat away from an electric component
Data Source
Figure 1~3
Figure 4~5
AI summary
The invention relates to a mounting base (1) for an electric component (3), comprising: a first surface (2) for receiving the electric component (3), and for receiving a heat load generated by said electric component (3), and a second surface (4) for dissipating heat from said mounting base. In order to obtain good heat dissipation properties the mounting base comprises evaporator channels (7) arranged in the vicinity of said first surface (2), condenser channels (8) in the vicinity of said second surface (4) and a first and second connecting part (9, 10) for passing fluid between said condenser channels (8) and evaporator channels (7).