Electronic Component Mounting Board Recessed Conductor Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic component mounting boards face challenges with increased thickness of conductor layers relative to insulating layers, leading to reduced rigidity and increased susceptibility to short-circuiting and deterioration due to exposure to moisture, especially as they become thinner and smaller.
Innovation Solution
The electronic component mounting board features a substrate with multiple layers and recesses on its side surfaces, where conductor layers with different metal materials are positioned between the layers, and electrodes with distinct metal materials cover the conductor layers within the recesses, reducing exposed conductor areas and enhancing bonding strength while minimizing short-circuiting risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic component mounting board becomes thinner and smaller, then the size and thickness are reduced, but the ratio of conductor layer thickness to insulating layer thickness increases and the distance between adjacent electrodes decreases
Solution Approach 1:
The patent extracts the conductor layers from full exposure by placing them within recesses formed in the insulating layers. This extraction protects the conductor layers from moisture exposure and reduces the risk of short-circuiting, directly addressing the reliability deterioration issue that arises when mounting boards become thinner and smaller.
Solution Approach 2:
The patent applies local quality by creating recesses only in specific locations where conductor layers are present, rather than uniformly treating the entire mounting board. The recesses provide localized protection to conductor layers while maintaining the overall thin and small structure of the mounting board, thus improving reliability without sacrificing size reduction.
2Length of stationary object
If the electronic component mounting board becomes thinner, then the thickness is reduced, but the rigidity decreases and conductor layers are more exposed
Solution Approach 1:
The patent uses the insulating layers as protective shells that enclose the conductor layers within recesses. This shell structure provides mechanical protection and maintains rigidity in the thinned mounting board, while the recesses ensure conductor layers are not directly exposed to moisture, thus protecting strength without requiring increased thickness.
3Ease of manufacture
If conductor layers are fully exposed, then manufacturing is simpler, but bonding strength decreases and short-circuiting risk increases
Solution Approach 1:
The patent segments the mounting board structure by creating recesses that separate the conductor layers from the external environment. This segmentation protects conductor layers from moisture and improves bonding strength, while the recesses can be formed using standard manufacturing processes, thus maintaining ease of manufacture while improving reliability.
Data Source
AI summary
An electronic component mounting board includes a substrate on which an electronic component is mountable. The substrate includes a plurality of layers stacked on one another, a plurality of conductor layers located between the plurality of layers, and a recess located continuously over side surfaces of the plurality of layers. The electronic component mounting board includes an electrode located in the recess and covering an end of at least one of the plurality of conductor layers in the recess. The conductor layers contain a metal material different from a metal material contained in the electrode. The conductor layers have outer edges located inward from an outer edge of the substrate in a plan view.