Electronic Component Mounting Board Shielding and Heat Dissipation
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Solution Overview
Problem
Existing electronic component mounting boards face challenges with electromagnetic noise interference and heat dissipation due to gaps in shield cases and increased device size, which affect the reliability and performance of electronic devices.
Innovation Solution
The electronic component mounting board incorporates a substrate with a mount area, a first insulating layer, a second insulating layer, and a first metal layer with a slope and additional portions to effectively shield against electromagnetic noise and enhance heat dissipation, while reducing voids and unintended short-circuiting through the use of insulating films and multiple metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shield cases are used to cover electronic components, then electromagnetic noise is reduced, but gaps between cases increase device size
Solution Approach 1:
The patent transitions from three-dimensional shield cases to two-dimensional insulating layers with metal patterns deposited on substrate surfaces. This dimensional reduction eliminates the need for bulky enclosures while maintaining electromagnetic shielding functionality through conductive patterns that block noise without requiring physical depth
Solution Approach 2:
The patent extracts the essential shielding function from traditional enclosed shield cases and implements it through separate functional layers (insulating layers with metal patterns). This allows the shielding capability to be integrated into the circuit board structure itself rather than requiring additional external housing components
2Reliability
If multiple insulating layers and metal layers are added to reduce noise and improve heat dissipation, then reliability is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functional requirements (electrical insulation, electromagnetic shielding, and heat dissipation) into an integrated multi-layer structure where insulating layers and metal patterns work together as a unified system. This consolidation achieves multiple benefits simultaneously while using standardized PCB manufacturing processes
Solution Approach 2:
The insulating layers with metal patterns serve multiple functions simultaneously: providing electrical insulation between conductive elements, blocking electromagnetic noise through conductive patterns, and facilitating heat dissipation through thermally conductive metal traces. This multi-functionality reduces the need for separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electromagnetic noise interference, improves heat dissipation, and enhances the reliability and performance of electronic devices by minimizing gaps and voids, leading to more stable and efficient operation.
Implementation Method 1
a first metal layer located between the first insulating layer and the second insulating layer
Implementation Method 2
improves heat dissipation
Data Source
AI summary
An electronic component mounting board reduces short-circuiting between a plurality of thick wiring conductors to improve reliability and electrical characteristics. An electronic component mounting board (1) includes a substrate (2) including a mount area (4) in which an electronic component (10) is mountable, a first insulating layer (2a) overlapping the mount area (4), a second insulating layer (2b) on a lower surface of the first insulating layer (2a), and a first metal layer (5) between the first insulating layer (2a) and the second insulating layer (2b).