Electronic Component Mounting Board Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic-component-mounting boards with female connectors face issues with long-term electrical reliability, miniaturization, and cost due to connector-based connections, and soldering lead wires directly to thin insulating layers on high-heat-dissipation substrates is inefficient due to heat loss and potential overheating of components.
Innovation Solution
The use of external-connection terminals with thermal conductivity less than the metal plate, composed of materials like resin or ceramic, allows direct soldering of lead wires without conventional connectors, ensuring efficient heat management and reduced component overheating, enabling enhanced reliability and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a female connector is used as the external-connection terminal, then electrical connection to external devices is achieved, but long-term electrical reliability deteriorates and device complexity increases
Solution Approach 1:
The invention extracts and eliminates the connector component from the system by directly soldering lead wires to the circuit pattern on the metal plate substrate. This removal of the connector intermediate component simplifies the structure, reduces points of failure, and improves long-term electrical reliability through direct wire connections.
Solution Approach 2:
The invention merges the external-connection terminal function directly into the metal plate substrate by soldering lead wires to the circuit pattern on the substrate surface. This integration eliminates separate connector components and creates a unified structure where the substrate itself serves as the connection interface.
2Device complexity
If lead wire is directly soldered to the circuit pattern on the thin insulating layer, then device complexity is reduced, but heat loss increases and soldering time increases
Solution Approach 1:
The invention replaces the traditional insulating layer with a metal plate substrate that provides both mechanical support and thermal management. The metal plate's high thermal conductivity substitutes for the insulating layer's electrical insulation function, allowing direct soldering while preventing heat loss to the substrate.
Solution Approach 2:
The invention changes the thermal parameter of the substrate from insulating (low thermal conductivity) to conductive (high thermal conductivity) by using a metal plate. This parameter change allows efficient heat dissipation during soldering, reducing soldering time and preventing heat-related defects while maintaining structural integrity.
3Productivity
If the entire electronic-component-mounting board is heated to reduce soldering time, then soldering speed increases, but electronic components are overheated and damaged
Solution Approach 1:
The invention applies local quality by creating a localized heating zone at the solder joint area on the metal plate substrate. The high thermal conductivity of the metal plate allows rapid heat dissipation from the soldering area, enabling localized heating that increases soldering speed while preventing overheating of nearby electronic components through efficient heat distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances long-term electrical reliability, reduces board size and thickness, and lowers costs by eliminating the need for connectors and optimizing soldering processes, while maintaining effective heat dissipation for electronic components.
Implementation Method 1
a high-heat-dissipation substrate including a metal plate (2a) having high-thermal conductivity
Implementation Method 2
The external-connection terminal (4) is formed of a material having a thermal conductivity less than that of the metal plate (2a)
Data Source
AI summary
The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced.