Mounting Bracket Conductive Plating Stress Management
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Solution Overview
Problem
The existing display module technology in mobile devices faces challenges with uneven light reflection and visible impressions on the phone's appearance due to arching deformation caused by conductive plating on the mounting bracket.
Innovation Solution
The implementation involves adding a conductive transition layer around the conductive plating layer, or creating an uneven serrated shape at the outer edge of the conductive plating layer, or digging holes in the conductive plating layer to reduce internal stress and arching deformation, thereby improving the flatness of the mounting bracket's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive materials are plated on the mounting bracket to improve electrical conductivity, then electrical conductivity between the mounting bracket and middle frame is improved, but the mounting bracket surface becomes deformed causing uneven light reflection and visible impressions
Solution Approach 1:
The conductive plating is divided into multiple separate conductive plating layers rather than applying a single continuous layer. Each plating layer is positioned at different heights on the mounting bracket, which segments the stress distribution and prevents uniform arching deformation across the entire surface.
Solution Approach 2:
Different regions of the mounting bracket are given different properties: the conductive plating layers are positioned at specific heights rather than uniformly across the surface. This local differentiation allows electrical conductivity to be improved where needed while maintaining surface flatness in visible areas.
2Reliability
If conductive plating is applied to the mounting bracket to achieve grounding, then electrical connection to the middle frame is improved, but internal stress causes arching deformation and uneven reflected light
Solution Approach 1:
The continuous conductive plating is segmented into multiple discrete plating layers at different heights. This segmentation distributes the internal stress generated during plating across multiple locations rather than concentrating it, thereby reducing overall arching deformation.
Solution Approach 2:
A filling material is introduced as an intermediary substance between the conductive plating layers and the mounting bracket surface. This filling material compensates for the arching deformation caused by internal stress, maintaining the overall flatness of the mounting bracket surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the impression degree and uneven light reflection on the electroplating region when the screen is off, resulting in a more uniform appearance and improved aesthetics of the mobile device.
Implementation Method 1
a material internal stress generated by a metal plating layer arranged on the mounting bracket gradually reduces from the conductive plating layer to the conductive transition layer
Data Source
AI summary
An electronic device includes a display module, a middle frame, and a battery cover. The display module and the battery cover are respectively located at two sides of the middle frame. The display module includes at least a display layer and a mounting bracket, the mounting bracket comprises a first surface and a second surface, the first surface faces the display layer, and the second surface faces the middle frame. A conductive plating layer is arranged on a partial region of the second surface of the mounting bracket, and a conductive transition layer is arranged at an outer periphery of the conductive plating layer. The conductive plating layer is electrically connected to the middle frame.