Electronic Component Mounting Conductor Shrinkage Stress
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Solution Overview
Problem
Existing electronic components face issues with cracking due to differential shrinkage of mounting and internal conductor materials during heat treatment, which affects the volume and integrity of the element.
Innovation Solution
The design includes a mounting conductor with a first region exposed and a second region connected to and covered by the element, where the second surface and third surface overlap with the first surface, reducing volume while maintaining surface area, and the internal conductor is connected away from the connection portion between these surfaces to minimize shrinkage and stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If the mounting conductor is disposed in the recess and connected to the internal conductor, then the volume of the element is sufficiently provided, but cracks occur in the element due to differential shrinkage during heat treatment
Solution Approach 1:
The mounting conductor is designed with different regional characteristics: the first region has a larger cross-sectional area for mechanical strength and mounting function, while the second region has a smaller cross-sectional area to reduce shrinkage. This local differentiation allows the conductor to fulfill multiple functions while minimizing differential shrinkage effects in critical areas.
Solution Approach 2:
The mounting conductor is divided into two distinct regions: the first region extending from the outer surface to the recess bottom, and the second region within the recess. This segmentation allows each region to be optimized for its specific function - the first region for mounting strength and the second region for reduced shrinkage.
2Reliability
If the volume of the mounting conductor is reduced to minimize shrinkage, then crack occurrence is reduced, but the mounting strength may be compromised
Solution Approach 1:
Different regions of the mounting conductor have different cross-sectional areas optimized for their specific functions. The first region maintains larger area for mounting strength, while the second region has smaller area for reduced shrinkage, achieving both strength and reliability requirements simultaneously.
Solution Approach 2:
The mounting conductor utilizes three-dimensional space effectively by extending vertically from the outer surface through the recess, with varying cross-sectional areas at different heights. This dimensional approach allows strength to be provided where needed while minimizing shrinkage in other regions.
3Strength
If the second surface and third surface do not overlap with the first surface, then the volume of the mounting conductor is larger providing better mechanical strength, but the shrinkage is increased causing more cracks
Solution Approach 1:
The mounting conductor is designed to extend in the vertical dimension from the outer surface through the recess, with the second and third surfaces overlapping the first surface in the plan view. This three-dimensional configuration provides mechanical strength through vertical extension while minimizing horizontal shrinkage effects.
Solution Approach 2:
The overlapping configuration of surfaces creates a localized volume reduction in the second region, which minimizes shrinkage in the critical area between the exposed and covered regions, while the overall conductor maintains sufficient volume for mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the occurrence of cracks in the element by minimizing shrinkage and stress concentration, while maintaining mounting strength and electromagnetic characteristics, and can improve the Q value of coils by allowing increased outer diameter without compromising surface area.
Implementation Method 1
A constituent material of the mounting conductor and a constituent material of the internal conductor shrink due to the thermal treatment
Data Source
AI summary
An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.