Electronic Component Mounting Device Height Control
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Solution Overview
Problem
Conventional electronic component mounting devices face challenges in achieving high precision and productivity due to warp deformation in boards, leading to poor mounting quality and reduced productivity, as existing methods rely on approximate curved surface models that fail to accurately represent the board's surface irregularities.
Innovation Solution
An electronic component mounting device with an operating head that moves up and down based on precise height measurements, using a height measuring device to store operation data that distinguishes between normal and high precision requirements for different components, allowing the operating head to adjust its movement accordingly by using either an approximate or individual operation position height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a curved surface model is used to approximate board warp deformation, then productivity is maintained, but manufacturing precision deteriorates due to local surface irregularities not being captured
Solution Approach 1:
The patent divides the board surface into multiple measurement sites and performs height measurements at each site individually. This segmentation allows the system to capture local surface irregularities that a global curved surface model would miss, while still maintaining efficient batch measurement across the entire board surface.
Solution Approach 2:
The patent applies different measurement and correction approaches to different regions of the board. By measuring height at multiple discrete sites and using these local measurements to determine operating head positions, the system adapts to local surface variations rather than applying a uniform approximation across the entire board.
2Manufacturing precision
If individual height measurements are performed at each operation position, then manufacturing precision is improved, but productivity deteriorates due to increased measurement time
Solution Approach 1:
The patent performs height measurements at multiple measurement sites before the actual mounting operation begins. This preliminary measurement allows the system to establish a comprehensive map of board surface variations in advance, enabling precise operating head positioning during subsequent mounting without slowing down the production process.
Solution Approach 2:
The patent measures height at more sites than strictly necessary for basic operation, using this excessive measurement data to create a comprehensive surface map. This partial redundancy ensures that even complex local irregularities are captured, providing sufficient precision data for all operation positions without requiring measurement at every single mounting point.
3Device complexity
If the board surface is assumed to be flat, then device complexity is reduced, but manufacturing precision deteriorates due to uncorrected warp deformation
Solution Approach 1:
The patent replaces complex mechanical adjustment mechanisms with a measurement-and-calculation approach. Instead of using movable tables or adjustable fixtures to physically compensate for board warp, the system uses height measurement data to calculate and control the operating head positions, achieving precision through information processing rather than mechanical complexity.
Data Source
AI summary
It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.