Chip Mounting Head Alignment via Rotational Center Calibration
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Solution Overview
Problem
Existing mounting devices face challenges in achieving highly-accurate alignment of chip components on substrates due to errors in determining the rotational center, leading to misalignment and potential electrical connection issues, especially when the required accuracy is less than 1 μm.
Innovation Solution
A mounting device with a mounting head, head-side stage, elevating unit, recognition unit, and control unit that calculates rotational center coordinates by using a center identification mark on the attachment tool or a dummy chip, allowing for precise alignment through multiple iterations of angle adjustments and positional corrections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the rotational center is determined using conventional methods, then the alignment process can be completed, but the alignment accuracy deteriorates due to errors in rotational center determination
Solution Approach 1:
The patent applies preliminary action by determining the rotational center coordinates before the actual alignment operation. The control unit calculates the rotational center coordinates by acquiring images of the center identification mark at multiple rotation angles and computing the intersection point of circular arcs. This preliminary determination of the rotational center enables subsequent high-accuracy alignment operations to proceed from a known reference point, resolving the contradiction between completing the alignment process and achieving high precision.
Solution Approach 2:
The patent implements feedback by using the determined rotational center coordinates to correct and adjust the alignment process. The control unit utilizes the calculated rotational center to compute correction amounts for the attachment tool's position and orientation. By feeding back the determined rotational center information into the alignment correction process, the system continuously refines the alignment accuracy, transforming the initial imprecise measurement into a corrected high-precision result.
2Reliability
If the rotational center coordinates are not accurately determined, then the alignment operation can proceed, but the electrical connection reliability deteriorates due to misalignment
Solution Approach 1:
The patent applies preliminary action by determining the rotational center coordinates before the actual alignment operation. The control unit calculates the rotational center coordinates by acquiring images of the center identification mark at multiple rotation angles and computing the intersection point of circular arcs. This preliminary determination of the rotational center enables subsequent high-accuracy alignment operations to proceed from a known reference point, resolving the contradiction between completing the alignment process and achieving high precision.
Solution Approach 2:
The patent implements feedback by using the determined rotational center coordinates to correct and adjust the alignment process. The control unit utilizes the calculated rotational center to compute correction amounts for the attachment tool's position and orientation. By feeding back the determined rotational center information into the alignment correction process, the system continuously refines the alignment accuracy, transforming the initial imprecise measurement into a corrected high-precision result.
Data Source
AI summary
A mounting device is provided that is configured to mount a chip component on a substrate. The mounting device includes a mounting head having an attachment tool that is configured to hold the chip component, and a head-side stage that is configured to adjust position and orientation of the attachment tool, a recognition unit configured to acquire an image from a direction perpendicular to a surface of the attachment tool, and a control unit operatively connected to the mounting head and the recognition unit. The control unit is configured to change a rotation angle of the head-side stage a plurality of times to acquire, by the recognition unit, images of a center identification mark provided at a portion movable together with the attachment tool, and configured to calculate a rotational center coordinate of the head-side stage from a plurality of pieces of position information of the center identification mark.