Electronic Component Mounting Head Nozzle Grouping Control
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Solution Overview
Problem
The existing electronic component mounting machines do not consider offset values of multiple divided boards, leading to reduced mounting efficiency due to the need for the mounting head to move between each board, thereby decreasing productivity.
Innovation Solution
A control device that groups some divided boards based on the positions of suction nozzles and boards within the printed circuit board, optimizing nozzle and board positions to efficiently mount components, and a data input device for user selection and data input to the control device, allowing for reduced memory usage by storing only reference board data and offset values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the mounting head moves to each divided board individually to mount electronic components, then the mounting position can be accurately controlled, but the mounting efficiency and productivity are reduced due to repeated movements
Solution Approach 1:
The control device pre-calculates and stores offset values between divided boards before mounting operations begin. This preliminary preparation allows the system to quickly determine mounting positions across multiple boards without performing repeated measurements or calculations during the mounting process, thereby maintaining positioning accuracy while improving efficiency
Solution Approach 2:
The system stores mounting position data from a reference divided board and uses offset values to generate mounting position data for other divided boards. This copying approach eliminates the need to store complete mounting position data for each individual board, reducing memory requirements while maintaining accurate positioning through the use of relative offset calculations
2Adaptability or versatility
If the mounting head moves between multiple divided boards to mount electronic components, then all boards can be serviced, but the number of movements increases and productivity decreases
Solution Approach 1:
Offset values between divided boards are pre-calculated and stored in the control device before mounting operations begin. This preliminary action enables the system to efficiently service multiple boards by simply adding the appropriate offset to the reference board's mounting position data, eliminating the need for repeated complex calculations and maintaining high productivity
Solution Approach 2:
The control device uses a universal reference board mounting position data set that can be applied to all divided boards through the addition of respective offset values. This universal approach allows the system to service multiple different boards using a single base data set, enhancing versatility while maintaining efficient operations
3Measurement precision
If complete mounting position data is stored for each divided board, then accurate mounting can be achieved, but memory requirements increase
Solution Approach 1:
Instead of storing complete mounting position data for each divided board, the system stores only the reference board's mounting position data and offset values. The mounting position data for other boards is generated by copying the reference data and adding the appropriate offset, significantly reducing memory requirements while maintaining full positioning accuracy
Solution Approach 2:
The system extracts only the essential reference board mounting position data and offset values from the complete set of board-specific data. This extraction approach removes redundant information while preserving all necessary mounting position information through the use of relative offset calculations
Data Source
AI summary
A control device of an electronic mounting machine that controls an operation of a mounting head when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles; sets some of the multiple divided boards within the printed circuit board as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board; and controls the multiple suction nozzles to mount the electronic components on the some of the divided boards within the one group at a same time.


