Mounting Head Parallelism Detection Using Triangular Pin Heights
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Solution Overview
Problem
Existing methods for detecting the degree of parallelism between a stage and a mounting head in semiconductor chip mounting devices are inadequate, as they only measure the direction of movement and fail to accurately assess the actual parallelism between the placement surface of the stage and the holding surface of the mounting head.
Innovation Solution
A method involving a stage, mounting head, encoder, and controller to detect the height of the mounting head at multiple positions on the placement surface, calculating the degree of parallelism based on these heights, using a measurement tool like a triangular pin to contact the holding surface and measure differences in height at various points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a contact pin is embedded in the placement surface and the sucking surface is brought into contact with the pin to measure inclination, then the measurement process can be performed, but only the degree of parallelism between the movement direction and the sucking surface is measured, failing to correctly detect the degree of parallelism between the placement surface and the holding surface
Solution Approach 1:
A measurement tool with a known height is introduced as an intermediary between the placement surface and the holding surface. The measurement tool serves as a reference standard that allows indirect measurement of the parallelism degree by comparing the position relationship between the measurement tool and the holding surface, thereby solving the problem of inaccurate direct measurement
Solution Approach 2:
The mechanical contact pin measurement method is replaced with a height-based measurement approach using an encoder. Instead of mechanically contacting the sucking surface with a pin, the system uses non-contact or minimal-contact height detection to measure the position of the holding surface relative to the placement surface, improving measurement accuracy while reducing mechanical complexity
2Measurement precision
If multiple measurement positions are used to detect heights, then the actual degree of parallelism can be accurately detected, but the measurement process time increases
Solution Approach 1:
The measurement tool is pre-positioned at multiple measurement positions on the placement surface before the actual height detection begins. By preparing the measurement locations in advance and systematically moving through predetermined positions, the measurement process efficiency is improved while maintaining the accuracy benefits of multi-point measurement
Solution Approach 2:
The measurement process uses periodic sampling at multiple predetermined positions rather than continuous measurement. Heights are detected at discrete measurement positions in a systematic sequence, which reduces the overall measurement time while still capturing sufficient data to calculate accurate parallelism degrees through periodic sampling of the surface characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately detects the actual degree of parallelism between the placement surface of the stage and the holding surface of the mounting head, ensuring precise alignment for semiconductor chip bonding.
Implementation Method 1
an encoder, detecting a height of the mounting head
Data Source
AI summary
In this method for detecting a degree of parallelism of a mounting device: a triangular pin is arranged at a point A on a placement surface of a stage; a mounting head is lowered, and a height of the mounting head when a holding surface comes into contact with a tip end of the triangular pin is detected using an encoder, after which the triangular pin is moved to a point B and the mounting head is lowered; the height of the mounting head when the holding surface comes into contact with the tip end of the triangular pin is detected by the encoder; and the degree of parallelism between the placement surface of the stage and the holding surface of the mounting head is calculated on the basis of the detected heights at point A and point B.