Electronic Component Mounting Head Position Correction
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Solution Overview
Problem
Conventional electronic component mounting techniques reduce productivity due to the time-consuming process of imaging the component extraction position multiple times, which increases the horizontal movement of the mounting head and delays the suction process.
Innovation Solution
An electronic component mounting apparatus with a movable mounting head equipped with an imaging camera that recognizes positional deviations between the component extraction position and the housing portion, allowing for real-time correction of the extraction position before subsequent component extraction, thereby minimizing the need for repeated imaging and maintaining productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the camera images the component extraction position multiple times to ensure accurate component extraction, then the extraction reliability is improved, but the productivity decreases due to increased horizontal movement time of the mounting head
Solution Approach 1:
The imaging camera performs imaging of the component extraction position in advance before the mounting head moves to that position. By capturing the image beforehand and processing the positional deviation data prior to the actual extraction operation, the system eliminates the need for time-consuming horizontal movements after imaging, thus maintaining productivity while ensuring accurate component extraction through pre-acquired positional information
Solution Approach 2:
The system uses the imaging camera to detect positional deviations between the component extraction position and the housing portion, then feeds this information back to the control unit. The control unit corrects the component extraction position based on this feedback, enabling accurate component extraction without requiring multiple imaging cycles or repeated horizontal movements of the mounting head
Data Source
AI summary
An electronic component mounting apparatus includes: a mounting head including a holder for extracting an electronic component and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera disposed on the mounting head for imaging a component extraction position, when the holder is at the component extraction position; a recognition unit for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in a component feeding unit or a position of the component in the housing portion; and a controller for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.