Mounting Head Suction Path Prevents Resin Fouling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor die stack mounting, the volatilization of non-conductive film components during heating leads to fouling of the vacuum suction hole, causing malfunctions and poor heating in the mounting process.
Innovation Solution
A mounting head with a suction path that includes a bending portion to direct gas flow, a dripping prevention portion to inhibit condensation droplets from reaching the bonding heater, and a storage portion to collect condensed gases or solids, preventing them from accumulating and sealing the vacuum suction hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the attachment is heated to bond the semiconductor die, then the solder melts and bonding progresses, but the non-conductive film components gasify and are suctioned into the vacuum suction hole causing fouling
Solution Approach 1:
The patent extracts the harmful gasified components from the bonding area by introducing a dedicated suction path that draws these components away from the vacuum suction hole before they can condense and foul the system. The suction path includes a suction hole positioned to capture gasified components at their source and channel them through a suction passage to an exhaust, preventing accumulation in the vacuum suction hole.
Solution Approach 2:
The patent introduces a suction path as an intermediary system between the bonding area and the vacuum suction hole. This intermediary pathway, including the suction hole, suction passage, and exhaust, serves as a mediator to transport harmful gasified components away from the critical vacuum suction hole area, preventing direct contamination.
2Measurement precision
If the vacuum suction hole is used to hold the semiconductor die, then the die can be precisely positioned, but condensed components accumulate and seal the hole causing malfunction
Solution Approach 1:
The patent extracts condensed components from the vacuum suction hole area by providing a separate suction path that actively removes gasified components before they can condense and block the vacuum suction hole. This extraction mechanism maintains the hole's functionality while preserving its precision positioning capability.
Solution Approach 2:
The patent implements a continuous removal system that discards gasified components through the suction path and exhaust, preventing their accumulation and condensation in the vacuum suction hole. This ensures the vacuum suction hole remains clear and functional throughout the bonding process.
3Manufacturing precision
If the gap between attachment and semiconductor die is narrow for precise bonding, then bonding accuracy improves, but gasified components condense in the gap causing poor heating
Solution Approach 1:
The patent extracts gasified components from the narrow gap area before they can condense and interfere with heating. The suction hole is positioned to draw gasified components away from the gap between the attachment and semiconductor die, maintaining both bonding accuracy and proper heating function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Inhibits fouling of the mounting head by effectively managing gas flow and condensation, ensuring continuous operation and preventing resin accumulation in the vacuum suction hole.
Implementation Method 1
a suction path, which has a first bending portion for bending a flowing path of gas suctioned from the first opening portion in the body portion and penetrates through the inside of the attachment, the bonding heater, and the body portion, and which discharges the gas suctioned from the first opening portion to the outside in the second opening portion
Implementation Method 2
a dripping prevention portion, which is formed in the suction path and inhibits droplets formed by condensation of the gas from dripping to the bonding heater
Implementation Method 3
a storage portion, which is disposed on a downstream side of the first bending portion in the suction path in a suction direction of the gas and stores the droplets formed by condensation of the gas or a solid formed by solidification of the droplets
Data Source
AI summary
A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.