Mounting Head Thermal Zoning for Uniform Chip Bonding Heat
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing mounting heads struggle to achieve uniform heating of chips, as the surface temperature of heaters like ceramic heaters is not completely uniform, and adjusting temperature distribution for different chip regions is challenging without increasing installation space and complexity.
Innovation Solution
A mounting head with a heater and independent cooling channels, controlled by a controller that adjusts refrigerant flow rates to achieve desired temperature distributions, allowing for precise heating and cooling of specific areas of the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a plurality of heaters are disposed to control temperature distribution, then the surface temperature of the chip can be partially controlled, but the installation space increases and the safety mechanism becomes complicated
Solution Approach 1:
The heater is divided into multiple independent heating regions (first heating region and second heating region) with different heating capabilities. This segmentation allows different parts of the chip to receive different amounts of heat, enabling temperature distribution control without requiring multiple separate heater units, thus avoiding increased installation space and safety mechanism complexity.
2Temperature
If a plurality of heaters are disposed to control temperature distribution, then the surface temperature of the chip can be partially controlled, but the installation space increases
Solution Approach 1:
The single heater is segmented into multiple heating regions with different heating values, allowing temperature distribution control within the same physical footprint. This eliminates the need for multiple separate heater units, thereby maintaining compact installation space while achieving the desired temperature control functionality.
3Device complexity
If one heater is used to heat the chip, then the installation space is minimized, but it is not possible to keep the heating temperature low only for a desired portion
Solution Approach 1:
Different regions of the heater are assigned different heating values to match the thermal requirements of different chip regions. The first heating region has a first heating value suitable for heating a first area of the chip, while the second heating region has a second heating value suitable for heating a second area of the chip. This local quality differentiation enables precise regional temperature control while maintaining a simple single-heater configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient and versatile heating of chips with desired temperature distributions, reducing the need for multiple heaters and minimizing space and safety complexity, while ensuring uniform heating and cooling.
Implementation Method 1
a heater arranged on a surface of the mounting tool opposite to the suction surface and heating the mounting tool
Implementation Method 2
a cooling mechanism having a plurality of cooling channels, which are independent of one another and guide a refrigerant respectively to a plurality of cooling areas set in the heater
Data Source
AI summary
A mounting head for bonding a chip to a bonding target includes: a mounting tool having a bottom surface which functions as a suction surface for sucking and holding the chip; a heater arranged on an upper surface of the mounting tool and heating the mounting tool; a cooling mechanism having a plurality of cooling channels which are independent of one another and guide a refrigerant respectively to a plurality of cooling areas set in the heater, and being capable of cooling the plurality of cooling areas independently of one another; and a controller controlling driving of the heater and the cooling mechanism. The controller independently controls a flow rate of the refrigerant flowing through the plurality of cooling channels so as to obtain a desired temperature distribution during heating of the heater.