Component Mounting Height Control for Adhesive-First Soldering
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Solution Overview
Problem
The existing component mounting systems face issues with dimensional errors and soldering failures due to the adhesive curing before the solder paste melts, leading to incorrect mounting heights and electrical contact issues, which reduce yield.
Innovation Solution
A component mounting system equipped with a solder inspection device and a mounting height setting unit that adjusts the target mounting height based on three-dimensional measurements of the solder paste, ensuring the electronic components are fixed at the ideal height, regardless of solder height variations, and an adhesive inspection device that determines adhesive quality using a consistent inspection reference height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the adhesive cures before the solder paste melts to fix the electronic component, then the component mounting speed and productivity are improved, but the mounting height becomes incorrect and dimensional errors occur
Solution Approach 1:
The system performs preliminary three-dimensional measurement of the solder paste height before component mounting, and uses this measurement information to pre-calculate and set the appropriate mounting height. This preliminary action allows the adhesive to cure quickly for productivity while the mounting height is already optimized based on actual solder conditions, preventing dimensional errors.
Solution Approach 2:
The system implements a feedback mechanism where the solder paste height is measured three-dimensionally, this measurement is fed back to the mounting height setting unit, which then adjusts the target mounting height accordingly. This closed-loop feedback ensures that even when adhesive cures rapidly, the component is mounted at the correct height based on real-time solder conditions.
2Reliability
If the mounting height is corrected based on solder paste height variation, then the soldering quality is improved, but the electronic component protrudes from the placement position causing dimensional errors
Solution Approach 1:
The system dynamically adjusts the target mounting height based on the measured solder paste height. The mounting height setting unit calculates the appropriate mounting height by considering the actual solder height and the expected sinking amount, creating a dynamic adjustment mechanism that balances soldering quality with dimensional accuracy.
Solution Approach 2:
The system changes the mounting height parameter based on measured solder paste characteristics. By adjusting this critical parameter according to actual solder conditions and expected sinking behavior, the system achieves both good soldering quality and correct final component position without protrusion.
3Speed
If the adhesive curing temperature is set lower than the solder paste melting temperature, then the adhesive fixation speed is improved, but the electrode portion separates from the electrode pattern causing soldering failure
Solution Approach 1:
The system performs preliminary measurement of solder paste height and preliminary calculation of the optimal mounting height before component mounting. This allows the adhesive to cure quickly at lower temperatures while the component is positioned to account for subsequent solder melting and sinking, ensuring both fast fixation and reliable soldering.
Solution Approach 2:
The system replaces purely thermal-based process sequencing with a measurement and calculation-based approach. Instead of relying on temperature sequencing alone, the system uses three-dimensional measurement and computational adjustment of mounting height to coordinate the adhesive curing and solder melting processes, ensuring reliable soldering even with low-curing-temperature adhesive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents dimensional errors and ensures reliable electrical contact, enhancing the yield by accurately determining adhesive quality and maintaining the correct mounting height, even when the adhesive cures before the solder melts.
Implementation Method 1
an irradiation unit configured to irradiate the solder with predetermined light; an imaging unit configured to take an image of at least the solder that is irradiated with the light
Implementation Method 2
a three-dimensional measurement unit configured to perform three-dimensional measurement of the solder, based on the image taken by the imaging unit
Implementation Method 3
the adhesive cures to fix the electronic component prior to melting of the solder paste
Implementation Method 4
prior to melting of the solder paste to wet and spread
Data Source
AI summary
A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.