Mounting Layer Alignment for VCSEL Cooling Structures
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Solution Overview
Problem
The existing method of manufacturing mounting areas for high-power Vertical Cavity Surface Emitting Laser (VCSEL)-array assemblies is time-consuming, costly, and introduces additional tolerances that are unacceptable for applications requiring precise control of positioning.
Innovation Solution
A mounting layer with corner and edge protrusions for alignment, aligning holes to define mounting areas, and a material suitable for direct bonding to a cooling structure, which eliminates the need for additional structuring steps and reduces positional tolerances, allowing for precise alignment and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If trenches are cut into the top surface of μ-channel coolers to create mounting areas, then a solder-stop structure is achieved and excess solder reservoir is provided, but the manufacturing process becomes time-consuming and costly with additional tolerances introduced
Solution Approach 1:
The mounting areas are prepared in advance as integral parts of the cooling structure during the same manufacturing process, rather than creating them afterward through separate laser structuring. This preliminary integration eliminates the need for additional processing steps and reduces cumulative tolerances.
Solution Approach 2:
The cooling structure and mounting layer are combined into a single integrated component manufactured in one process. The mounting areas, corner protrusions, and edge protrusions are all created simultaneously as part of the same laser structuring operation, merging multiple functions into one manufacturing step.
2Ease of manufacture
If separate laser structuring is used to create mounting areas after manufacturing μ-channel coolers, then mounting areas are provided, but additional tolerances are introduced with respect to positioning
Solution Approach 1:
The cooling structure and mounting layer are manufactured together in a single laser structuring process, combining what were previously separate manufacturing steps. This integration ensures that the mounting areas are precisely positioned relative to the cooling channels without introducing additional alignment tolerances.
Solution Approach 2:
The mounting areas are defined during the initial manufacturing of the cooling structure, before assembly takes place. This preliminary definition of mounting areas ensures that subsequent assembly operations can achieve high positioning accuracy without needing to account for additional tolerances from separate structuring steps.
3Manufacturing precision
If a mounting layer with corner and edge protrusions is used for alignment, then positioning accuracy is improved, but the device complexity increases
Solution Approach 1:
The alignment features (corner and edge protrusions) are integrated into the mounting layer as a single laser-structured component, combining multiple alignment functions into one manufactured part rather than requiring separate alignment elements.
Solution Approach 2:
The mounting layer's corner and edge protrusions automatically provide alignment functionality during assembly without requiring additional external alignment mechanisms or complex positioning systems. The structure aligns itself with the cooling channels through the protrusion geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easy and cost-effective manufacturing of mounting layers with high positioning accuracy for light emitting semiconductor devices, reducing additional tolerances and simplifying the assembly process while ensuring efficient heat transfer and structural integrity.
Implementation Method 1
The material of the mounting layer may advantageously have a high thermal conductivity above 10 W/(m*K). A high thermal conductivity does have the advantage that heat may be transferred faster from the light emitting semiconductor device to the cooling structure.
Data Source
AI summary
The invention describes a mounting layer (200) for mounting at least two light emitting semiconductor devices. The mounting layer (200) comprises corner protrusion (205) and edge protrusion (210) for aligning the mounting layer (200) to the cooling structure (100). The mounting layer (200) further comprises aligning holes (215) defining mounting areas (270) for mounting the light emitting semiconductor devices. The mounting layer (200) enables, for example, manufacturing of a μ-channel cooler with mounting areas (270) by means of one direct bonding process. Tolerances may thus be reduced. The invention further describes a cooling structure (100) like a μ-channel cooler comprising such a mounting layer (200) and a light emitting structure comprising such a cooling structure (100). Furthermore, methods of manufacturing such a mounting layer (200), cooling structure (100) and light emitting structure are described.