Component Mounting Machine Airflow Design for Dust Control
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Solution Overview
Problem
In component mounting machines, dust generated during tape peeling can flow to the backside of the machine body, potentially adhering to cameras and printed circuit boards, leading to recognition errors and manufacturing defects.
Innovation Solution
A component mounting machine design that includes a blower positioned to direct air from the backside of the machine body towards the tape peeling section, combined with a tape collection duct and upward suction and exhaust devices to prevent dust from reaching critical components, and a tubular blower with holes to effectively blow air across the peeling section.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a tape collection duct is provided further to the back side of the mounting machine body than the tape peeling section, then carrier tape can be collected after component pickup, but dust generated in the tape peeling section flows to the back side without being suctioned, causing component mounting defects
Solution Approach 1:
The invention applies preliminary anti-action by introducing a blower that generates air flow from the back side toward the front side before dust can accumulate and flow backward. This preventive air flow counteracts the natural dust migration path, stopping dust from reaching the lens and printed circuit board before contamination occurs
Solution Approach 2:
The invention uses pneumatic principles by employing a blower to create controlled air flow through the machine interior. The air flow acts as a pneumatic barrier that directs dust particles away from critical components, using gas dynamics to solve the dust contamination problem
2Object-generated harmful factors
If air is suctioned inside the tape collection duct from an inlet, then dust can be separated using a filter, but a portion of dust-containing air flows to the back side without being suctioned
Solution Approach 1:
The invention segments the dust control function into two parts: the tape collection duct with filter for dust separation, and the blower system for dust direction control. This segmentation allows each system to perform its specialized function - filtration and airflow management - thereby solving the limitation of the single suction system
Solution Approach 2:
The blower acts as an intermediary device between the dust source (tape peeling section) and the critical components (lens and printed circuit board). By introducing this intermediate air flow mechanism, dust particles are actively directed away from sensitive areas, complementing the passive filtration system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents dust from adhering to cameras and printed circuit boards, enhancing component recognition precision and preventing defects by ensuring airflow directs dust away from critical areas and effectively manages airflow to prevent reverse flow and temperature rise.
Implementation Method 1
a blower which blows air from a position further to the back side of the mounting machine body than the component supply position and further to the front side of the mounting machine body than the component mounting position toward the tape peeling section
Implementation Method 2
dust is separated using a filter belonging to the suction fan
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
In a component mounting machine 1, air which is blown from a blower 51 flows from the back side of a mounting machine body 3 toward the front side of the mounting machine body 3 through a tape peeling section 25 of a tape feeder 21. Thereby, it is possible to prevent dust, which is particularly generated in the tape peeling section 25, from adhering to a lens of a component imaging camera 37 for imaging a component P, a printed circuit board B, or the like. Consequently, it is possible to increase recognition precision of the component P, and it is also possible to increase mounting precision by preventing contact defaults of the component P on the printed circuit board B.