Mounting Machine Optimization for Defective Circuit Patterns
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for improving throughput during mounting work on multiple-board substrates with defective circuit patterns are inefficient, as they require unnecessary back-and-forth movement between the mounting machine and the supply device due to the need to skip mounting on defective patterns, which limits the number of components that can be held and mounted simultaneously.
Innovation Solution
An optimization program and mounting machine configuration that sets a mounting work order to hold and mount electronic components intended for a single circuit pattern at a time, eliminating the need to hold components for defective patterns and reducing unnecessary movement by allowing all capable suction nozzles to focus on non-defective patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mounting work is performed on multiple-board substrates with defective circuit patterns using conventional methods, then mounting can be skipped on defective patterns, but unnecessary back-and-forth movement occurs between the mounting machine and supply device, reducing throughput
Solution Approach 1:
The patent segments the mounting work into separate operations for each circuit pattern. By identifying defective circuit patterns in advance, the system divides the mounting task to exclude defective areas, allowing the mounting head to focus only on valid patterns without unnecessary trips to the supply device for components destined for defective areas.
Solution Approach 2:
The system performs preliminary identification of defective circuit patterns before mounting begins. This advance detection allows the optimization program to pre-calculate an efficient mounting sequence that avoids defective areas, eliminating wasted movements before the actual mounting process starts.
2Productivity
If electronic components are held by multiple component holding tools simultaneously for different circuit patterns, then more components can be mounted in parallel, but components for defective patterns are unnecessarily handled, reducing efficiency
Solution Approach 1:
The patent applies local quality by making the component holding capability selective rather than uniform. The optimization program determines which specific component holding tools should hold components based on the actual mounting requirements for each circuit pattern, ensuring that tools are only occupied with components needed for non-defective patterns.
Solution Approach 2:
The system effectively discards the plan to hold components for defective circuit patterns by identifying defects in advance. The optimization program recalculates the component holding assignment to exclude defective areas, allowing the system to recover the capacity of component holding tools for productive use on valid patterns only.
Data Source
AI summary
When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.