Component Mounting Machine Nozzle Dipping Control
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Solution Overview
Problem
In component mounting machines, when skip information is included in a production job due to factors like scratches on divided board sections, the collective dipping of nozzles can result in coating agent adhering to nozzles not holding components, and individual dipping of each nozzle is time-consuming as the number of nozzles increases.
Innovation Solution
A component mounting machine with a mounting head that can switch between collective and individual nozzle lifting modes, using a memory section to group components and a control section to manage dipping and mounting operations, allowing collective dipping for scheduled groups and individual dipping for unscheduled components, thereby optimizing time and preventing coating agent adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If collective dipping is performed for all nozzles, then dipping efficiency is improved, but coating agent may adhere to nozzles not holding components
Solution Approach 1:
The patent segments the dipping process into two distinct modes: collective dipping mode for nozzles holding components and individual dipping mode for nozzles not holding components. The control section automatically selects the appropriate mode based on whether each nozzle is holding a component, thus preventing coating agent adherence to empty nozzles while maintaining high efficiency for component nozzles.
2Reliability
If individual dipping is performed for each nozzle, then coating agent adherence to empty nozzles is prevented, but dipping time increases significantly
Solution Approach 1:
The patent implements a dynamic dipping strategy where the dipping mode (collective or individual) is flexibly switched based on the real-time state of each nozzle. The control section dynamically determines whether to perform collective or individual dipping for each nozzle based on component holding status, optimizing the balance between speed and accuracy for each specific case.
3Manufacturing precision
If pickup is skipped for certain divided board sections, then mounting accuracy is improved, but dipping process complexity increases
Solution Approach 1:
The control section uses feedback from skip information in the production job to automatically adjust the dipping process. When skip information indicates that pickup should be skipped for certain divided board sections, the control section receives this feedback and switches to individual dipping mode for those specific nozzles, while maintaining collective mode for other nozzles, thus managing complexity through intelligent control.
Data Source
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AI summary
A component mounting machine includes a mounting head configured to select and execute an individual mode in which lifting and lowering is performed for each of multiple holding tools, each of which holds a component and a collective mode in which the holding tools are lifted and lowered collectively; a memory section configured to store multiple collective lifting and lowering scheduled groups in each of which the components of which the number is the same as the number of holding tools are grouped; and a control section configured to subsequently execute holding of the component by the holding tool, dipping of the component into a coating agent, and mounting of the component on a board. In a case where a component for which the holding by the holding tool is to be skipped is included in the collective lifting and lowering scheduled group, the control section prohibits the holding of the component in the group, and allocates a component, for which the holding by the holding tool is not to be skipped, in the group, as a component in a new group. In a case where the number of components in the new group is the same as the number of holding tools, the dipping for the new group is performed in the collective mode, and in a case where the number of components in the new group is smaller than the number of holding tools, the dipping for the new group is performed in the individual mode for each holding tool to which the component is allocated.