Component Mounting Machine Thermal Deformation Correction
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Solution Overview
Problem
The component mounting machine faces challenges in maintaining accuracy due to thermal deformation, which increases positional deviation over time, leading to inefficient mounting operations when frequent corrections are made, and reduced accuracy with longer set times.
Innovation Solution
A component mounting machine and method that utilize a correction necessity determining section to assess the need for positional corrections based on image data from component and board cameras, allowing for timely adjustments of relative position coordinates to maintain accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the set time for positional correction is extended, then the component mounting operation efficiency is improved, but the positional deviation of the mounting head increases due to thermal deformation
Solution Approach 1:
The system continuously monitors the positional deviation of the mounting head through imaging by the component camera and board camera, and dynamically adjusts the correction timing based on the actual deviation amount. This feedback mechanism allows the system to extend the correction interval when deviation is small (improving efficiency) while ensuring correction when deviation exceeds the threshold (maintaining precision).
Solution Approach 2:
The correction timing is made dynamic rather than fixed. The system adjusts the correction interval based on the real-time thermal deformation state of the mounting head, transitioning from a static preset time approach to a dynamic correction strategy that adapts to changing thermal conditions during operation.
2Manufacturing precision
If the set time for positional correction is shortened, then the mounting accuracy is maintained, but the component mounting operation efficiency decreases due to frequent corrections
Solution Approach 1:
The system uses imaging data from cameras to continuously monitor the actual positional deviation of the mounting head. This feedback allows the system to determine the optimal correction timing based on real-time conditions, avoiding unnecessary frequent corrections while ensuring accuracy is maintained when needed.
Solution Approach 2:
The system changes the correction timing parameter from a fixed preset value to a dynamic value based on the actual thermal deformation state. By adjusting the correction interval according to the measured deviation amount and thermal conditions, the system optimizes both accuracy and efficiency.
3Manufacturing precision
If positional correction is performed frequently, then the mounting accuracy is maintained, but the operational efficiency is reduced due to increased correction frequency
Solution Approach 1:
The system continuously monitors positional deviation through camera imaging and only initiates correction when the deviation exceeds a predetermined threshold. This feedback-based approach ensures accuracy is maintained when necessary while avoiding unnecessary corrections that would waste time.
Solution Approach 2:
The system performs preliminary imaging and measurement of the mounting head position before each potential correction. By assessing the actual deviation amount in advance, the system can determine whether correction is truly necessary, avoiding premature or unnecessary corrections that would result in time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient component mounting operations while maintaining high accuracy by correcting relative position coordinates at appropriate times, reducing the impact of thermal deformation and improving overall operational efficiency.
Implementation Method 1
the amount of thermal deformation of the component mounting machine changes with the elapsed time from the start of component mounting operation
Data Source
Figure 1
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AI summary
A component mounting machine including: a moving device configured to move between a component supply position and a circuit board; a mounting head provided on the moving device and configured to pick up a component supplied to the component supply position and mount the picked-up component on the circuit board; a component camera configured to image the component held by the mounting head from below the mounting head; a board camera provided on the moving device and configured to image the circuit board from above; an imaging position memory section configured to memorize imaging position coordinates that are position coordinates of the moving device during imaging by the component camera, based on image data acquired by imaging of the mounting head by the component camera; a relative position memory section configured to memorize relative position coordinates that are a relative position of the mounting head with respect to the board camera; and a correction necessity determining section configured to perform imaging of the mounting head by the component camera when the moving device has arrived at the imaging position coordinates, and determine whether it is necessary to correct the relative position coordinates memorized in the relative position memory section, based on a position of the mounting head understood from image data acquired from the imaging.