Electronic Component Mounting Package Noise Shielding
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Solution Overview
Problem
Existing electronic component mounting packages face performance deterioration due to noise from external sources, as passive elements near semiconductor elements are not adequately shielded.
Innovation Solution
The package includes a wiring portion with a semiconductor element facing a main surface and a thin film passive element in between, with first and second terminals disposed on the outer side of the passive element to alleviate noise, ensuring a longer terminal length than the passive element thickness, and strategically arranged to surround it, minimizing noise influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a passive element is disposed inside a substrate or between substrate and semiconductor element, then the passive element can be integrated close to the semiconductor element, but the passive element is exposed to noise from outside and its performance deteriorates
Solution Approach 1:
A terminal structure is introduced as an intermediary component between the passive element and the external environment. This terminal extends beyond the passive element in plan view and has a length greater than the passive element thickness, serving as a noise barrier that blocks electromagnetic noise from reaching the passive element while allowing the passive element to remain integrated close to the semiconductor element.
2Object-affected harmful factors
If the terminal length in lamination direction is made larger than the passive element thickness, then noise shielding effect is enhanced, but the overall package height increases
Solution Approach 1:
The terminal structure is designed with non-uniform dimensions: it extends beyond the passive element in plan view (lateral extension) and has selective length in the lamination direction (greater than passive element thickness but controlled overall height). This local variation in dimensions provides effective noise shielding at the critical interfaces while controlling the overall package height through strategic placement rather than uniform thickening.
3Object-affected harmful factors
If terminals are disposed to surround the whole circumference of the passive element, then noise shielding is maximized from all directions, but the device complexity increases
Solution Approach 1:
The terminal structure is segmented into multiple portions that collectively surround the passive element. Rather than a single complex terminal, multiple terminal segments are arranged around the passive element's circumference, with at least one terminal having sufficient length to provide effective shielding. This segmentation simplifies the design of individual terminals while achieving comprehensive noise protection through their collective arrangement.
Data Source
AI summary
An electronic component mounting package includes a semiconductor element which is disposed such that an active surface faces a main surface of a wiring portion, and which is electrically connected to the wiring portion via a first terminal; and a thin film passive element which is disposed between the active surface of the semiconductor element and the main surface of the wiring portion when seen in a lamination direction, and which is electrically connected to the semiconductor element. A part of the first terminal is disposed on an outer side with respect to the thin film passive element in a plan view. A length of the first terminal in the lamination direction disposed on the outer side with respect to the thin film passive element is larger than a thickness of the thin film passive element in the lamination direction.