Variable-Thickness Mounting Pad for Substrate Release
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrates tend to stick to the vacuum suction pads of mounting mechanisms during transfer operations in substrate processing systems, leading to transfer errors and potential damage due to collision or falling of substrates.
Innovation Solution
The use of a mounting pad with an annular outer edge portion of varying thickness, which projects in a direction intersecting the surface to surround the substrate, reduces sticking by creating separation start points and facilitating easier substrate release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a vacuum suction pad is used to hold the substrate, then the substrate can be securely held during transfer, but the substrate tends to stick to the mounting mechanism causing transfer errors and potential damage
Solution Approach 1:
The mounting pad employs local quality by creating a thickness variation in the outer edge portion, where at least one portion has a different thickness from other portions. This localized structural difference creates separation start points that prevent substrate sticking while maintaining secure holding in the center region, thus resolving the contradiction between reliable substrate holding and preventing harmful sticking effects.
2Productivity
If the mounting pad structure is modified to prevent sticking, then transfer efficiency improves, but the structural complexity of the mounting pad increases
Solution Approach 1:
The invention applies parameter changes by modifying the thickness parameter of the outer edge portion of the mounting pad. Instead of changing the overall structure or material composition, the solution varies the thickness parameter locally to create separation start points. This approach improves transfer efficiency by preventing substrate sticking while maintaining relatively simple pad structure, as it only requires adjusting one geometric parameter rather than redesigning the entire mounting mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes substrate sticking to the mounting mechanism, enhancing transfer efficiency and reducing the risk of substrate damage during transfer operations.
Implementation Method 1
The mounting mechanism is provided with a vacuum suction pad for holding the substrate by vacuum suction
Data Source
AI summary
There is a mounting pad for placing an object, comprising: a base; and an annular outer edge portion that is provided on one surface of the base, projects in a direction intersecting a surface direction of said one surface to surround an outer edge of said one surface, and is to be in contact with the object, wherein a thickness of the outer edge portion in at least one portion of the outer edge portion is different from a thickness of the outer edge portion in the other portions of outer edge portion.