3D Paste Shape Measurement for Mounting Defect Identification
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Solution Overview
Problem
Conventional mounting apparatuses for chip components on substrates struggle to accurately determine the cause of defects due to limited two-dimensional image information, making it difficult to differentiate between application and mounting processing issues.
Innovation Solution
A mounting apparatus that includes a paste application part, a bonding part, and imaging units to capture three-dimensional shapes of the paste and chip component before and after mounting, allowing for evaluation of both application and mounting processes to identify defect causes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If three-dimensional measurement is performed after chip component mounting, then the shape of the paste or chip component can be grasped three-dimensionally, but it becomes difficult to determine whether the defect is caused by application processing or mounting processing
Solution Approach 1:
The system performs preliminary three-dimensional measurement of the paste shape before chip component mounting. This preliminary measurement captures the application quality and establishes a baseline for later comparison with post-mounting measurements, enabling defect cause identification.
Solution Approach 2:
The measurement process is segmented into two distinct stages: pre-mounting measurement of the paste and post-mounting measurement of the assembled structure. By separating the measurement timing, the system can attribute defects to specific process stages.
2Device complexity
If only two-dimensional image information is used, then the imaging system remains simple, but the height and three-dimensional shape of the chip component cannot be known
Solution Approach 1:
The imaging system transitions from two-dimensional camera imaging to three-dimensional laser displacement measuring instrument imaging. This dimensional upgrade enables height and volumetric measurement of the paste and chip component while maintaining system integration.
3Reliability
If three-dimensional measurement is performed after mounting, then the quality of final products can be determined, but the quality of application processing cannot be determined
Solution Approach 1:
The system performs preliminary three-dimensional measurement of the paste shape before chip component mounting. This preliminary measurement captures the application quality and establishes a baseline for later comparison with post-mounting measurements, enabling defect cause identification.
Data Source
AI summary
A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.