Mounting Plate Anchor Features Align Layered Electronic Assemblies

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Layered electronic assemblies face significant tolerance stacking issues due to manufacturing inaccuracies, leading to misalignment of electrical contacts and requiring complex and costly flexible interconnects for compensation.

Innovation Solution

The use of compression connectors with perpendicularly extending pins and a mounting plate with anchor features allows for precise alignment and assembly of electronic components without soldering, reducing tolerance deviations and assembly complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If specialized flexible interconnects are used to compensate for tolerance stacking issues, then alignment of electrical contacts between layers is improved, but device complexity and assembly time increase

Engineering Contradiction:
Improvealignment of electrical contactsVSAvoidassembly complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention divides the assembly system into modular components: a mounting plate with anchor features, layer assemblies with alignment features, and standardized connectors. Each layer assembly is an independent module that can be manufactured separately and assembled systematically, reducing overall assembly complexity while maintaining precision

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention replaces complex flexible interconnects and soldering processes with a mechanical alignment and attachment system. Alignment features (pins, holes, registration marks) provide precise positioning, while simple mechanical fasteners replace sophisticated interconnect structures, thereby reducing device complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If specialized flexible interconnects and soldering techniques are used, then electrical contact alignment is improved, but assembly time increases

Engineering Contradiction:
Improveelectrical contact alignmentVSAvoidassembly time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

Alignment features such as pins, holes, and registration marks are pre-formed during the manufacturing of individual layer assemblies. This preliminary preparation eliminates the need for time-consuming alignment operations during final assembly, as components are designed to self-align through their inherent geometric features

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention replaces time-consuming soldering processes with rapid mechanical attachment methods. Standardized connectors and simple fasteners enable quick connection of layers without requiring skilled soldering operations, thereby significantly reducing assembly time while maintaining electrical contact precision

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional manufacturing methods are used for ceramic components, then manufacturing flexibility is maintained, but manufacturing precision of electrical contact locations deteriorates

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidelectrical contact location precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention applies different quality requirements to different features of ceramic components. While electrical contact locations require high precision, other features (overall dimensions, non-critical surfaces) can be manufactured with standard tolerances. This selective approach maintains manufacturing flexibility for non-critical features while ensuring precision where needed through targeted processes

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The mounting plate with anchor features serves as an intermediary reference frame that compensates for tolerances in individual ceramic components. By establishing a precise external reference system, the invention allows ceramic components to be manufactured with standard tolerances while achieving precise overall alignment through the intermediary mounting structure

Inventive Principle:
Principle #24Intermediary (Mediator)

4Adaptability or versatility

If independent electronic components are used in the first layer, then design flexibility is improved, but tolerance stacking issues worsen

Engineering Contradiction:
Improvedesign flexibilityVSAvoidtolerance stacking deviations
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The invention maintains segmentation of independent electronic components in the first layer for design flexibility, but introduces alignment features on each component that enable systematic assembly. The mounting plate with anchor features provides a reference framework that accommodates multiple independent components while controlling their relative positions, thereby managing tolerance stacking without sacrificing component independence

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mounting plate acts as an intermediary reference structure between independent electronic components and subsequent layers. It provides anchor features that establish precise reference locations, allowing independent components to be positioned with controlled tolerances. This intermediary framework enables design flexibility at the component level while ensuring overall assembly precision

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS9379469B1Method for assembling a multiple layer electronic assembly
Publication Date: 2016.06.28 LOCKHEED MARTIN CORP
  • US9379469B1 patent drawing
  • US9379469B1 patent drawing
  • US9379469B1 patent drawing

AI summary

Mechanisms for aligning electrical contacts of electronic components in a multiple layer electronic assembly are disclosed. A mounting plate is configured to align multiple layers of the multiple layer electronic assembly. The mounting plate includes a surface that a plurality of first anchor features at first predetermined locations of the surface configured to anchor a plurality of first layer electronic assemblies with respect to the surface. The mounting plate also includes a plurality of second anchor features at second predetermined locations configured to anchor at least one second layer electronic assembly with respect to the plurality of first layer electronic assemblies.