Electronic Component Mounting System Position Correction Modes
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Solution Overview
Problem
The existing electronic component mounting systems face challenges in achieving uniform bonding quality due to varying self-alignment effects based on electrode shape, component size, mass, and solder characteristics, leading to potential bonding failures when using uniform position correction methods.
Innovation Solution
An electronic component mounting system that employs a printing apparatus to create recognition marks on a board, allowing for two mounting modes: one correcting positions based on first recognition marks and another correcting positions based on solder marks to account for deviations, enabling precise placement according to each component's characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform position correction based on solder printing positions is applied to all electronic components, then mounting position accuracy is improved for components that benefit from self-alignment, but bonding quality deteriorates for components where self-alignment effect is insufficient or causes rotation
Solution Approach 1:
The patent applies different mounting position correction methods to different electronic components based on their individual characteristics. Components are classified into multiple categories considering factors such as mass, planar shape symmetry, and electrode arrangement. Each category receives customized correction processing, allowing the system to optimize for self-alignment effect where beneficial while avoiding it where harmful, thereby simultaneously improving mounting precision and bonding reliability.
2Device complexity
If solder printing position measurement is used for position correction, then the need for separate solder inspection is reduced, but positioning accuracy deteriorates when solder printing deviations are significant
Solution Approach 1:
The patent changes the reference parameter for position correction from solder printing positions to electrode positions. By using electrode positions as the correction reference, the system eliminates dependency on solder printing quality and achieves accurate positioning regardless of solder printing deviations. This parameter change maintains process simplicity while significantly improving positioning accuracy.
3Ease of operation
If position correction is applied without considering component characteristics, then the mounting process is simplified, but bonding quality deteriorates due to inappropriate correction for certain component types
Solution Approach 1:
The patent introduces dynamic adaptability to the mounting process by automatically selecting different correction methods based on component characteristics. The system dynamically adjusts the correction strategy for each component type, transitioning between different correction modes without manual intervention. This maintains operational simplicity while ensuring bonding quality through characteristic-based customization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures proper mounting position correction without requiring solder inspection, enhancing bonding quality by adapting to the specific characteristics of each electronic component, reducing the likelihood of bonding failures and improving the overall quality of the mounted board.
Implementation Method 1
a printing apparatus which prints solder on a component bonding electrode formed on a board
Implementation Method 2
electronic component mounting apparatus which positions the solder-printed board, picks up an electronic component from a components supply unit by a mounting head, and transfers and places the electronic component
Implementation Method 3
utilizing what is called a self-alignment effect that electrodes attract an electronic component due to the surface tension of molten solder in a reflow process that is executed after placement of the component
Data Source
AI summary
An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information.