Mounting Stage Embedment Structure for Plasma Discharge Suppression

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Solution Overview

Problem

High-frequency power applied to plasma processing apparatuses can cause abnormal electrical discharge in the heat transfer gas holes, leading to degraded processing quality and reduced yield due to the concentration of energy and potential misalignment from thermal expansion.

Innovation Solution

An embedment member is designed with a first and second embedment member that are not mutually fixed, featuring a step and protrusion shape to maintain a heat transfer gas path and prevent breakage, ensuring the embedment member does not break due to thermal expansion and misalignment, and is positioned to prevent abnormal electrical discharge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single embedment member is used to maintain the heat transfer gas path, then the structural simplicity is maintained, but the embedment member is prone to breakage due to thermal expansion and misalignment

Engineering Contradiction:
Improveembedment member structureVSAvoidembedment member integrity
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The embedment member is divided into multiple separate embedment members (first embedment member and second embedment member) that are not mutually fixed. This segmentation allows each member to independently accommodate thermal expansion and misalignment, preventing breakage while maintaining the heat transfer gas path.

Inventive Principle:
Principle #1Segmentation

2Productivity

If high-frequency power is applied to the plasma processing apparatus, then the processing efficiency is improved, but abnormal electrical discharge occurs in the heat transfer gas holes

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidabnormal electrical discharge
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The embedment members serve as intermediary elements that line the heat transfer gas holes. These embedment members made of material with appropriate electrical properties prevent abnormal electrical discharge while allowing the high-frequency power to be effectively applied for plasma generation, thus maintaining processing efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the embedment member is fixed rigidly to maintain position, then the alignment precision is improved, but the embedment member breaks due to thermal expansion

Engineering Contradiction:
Improvehole alignmentVSAvoidembedment member strength
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The embedment members are designed to be non-fixed relative to each other, allowing dynamic adjustment and independent movement. This dynamic configuration enables the embedment members to accommodate thermal expansion and misalignment without breaking, while still maintaining the heat transfer gas path functionality.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents abnormal electrical discharge and maintains the integrity of the embedment member, ensuring consistent processing quality and yield by reducing the risk of breakage and allowing sufficient heat transfer gas flow.

Implementation Method 1

an embedment member disposed inside the first hole and the second hole... effectively prevents abnormal electrical discharge

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a first hole penetrating through the mounting surface and the back surface... for supplying a heat transfer gas

Methodology Applied
Scientific EffectHeat transfer: Convection

Data Source

PatentUS12033886B2Plasma processing apparatus and method for manufacturing mounting stage
Publication Date: 2024.07.09 TOKYO ELECTRON LTD
  • US12033886B2 patent drawing
  • US12033886B2 patent drawing
  • US12033886B2 patent drawing

AI summary

A plasma processing apparatus includes a mounting stage including a mounting surface, on which an object to be processed is mounted, a back surface provided on a side opposite to the mounting surface, a plate-like member, in which a first hole penetrating through the mounting surface and the back surface is formed, and a base having a supporting surface for supporting the plate-like member and having a second hole communicating with the first hole; and an embedment member disposed inside the first and second holes, the first embedment member being disposed inside the first hole, the second embedment member being disposed inside the second hole, wherein the first embedment member and the second embedment member are not mutually fixed, and the first embedment member has a portion having a wider width than a width of an upper end portion on a lower side than the upper end portion.