Mounting Stage Surface Smoothing via Thermal Expansion
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Solution Overview
Problem
The existing surface processing methods for mounting stages in substrate processing apparatuses require multiple tools and steps, leading to inefficiency and non-conformity with wafers, resulting in inconsistent plasma processing temperatures due to changes in microscopic roughness of the mounting surface.
Innovation Solution
A surface processing method that thermally expands the substrate mounted on the mounting stage using plasma, allowing the substrate to rub against the mounting surface and smooth it microscopically, eliminating the need for additional processing devices and steps, and ensuring the mounting surface conforms to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple processing apparatuses (grindstone, lapping plate, tape lapping apparatus) are used to smooth the mounting surface, then the mounting surface becomes smooth when viewed microscopically, but the process requires much time and effort and cannot be readily used
Solution Approach 1:
The substrate itself serves as the processing tool to smooth the mounting surface. During plasma processing, the substrate is heated and expanded, causing it to rub against the mounting surface and smooth it microscopically. This eliminates the need for separate processing apparatuses and reduces processing time while achieving the desired surface smoothness.
Solution Approach 2:
The substrate's temperature and physical state are changed during plasma processing. By heating the substrate to high temperatures, it expands and its physical properties change, enabling it to effectively smooth the mounting surface through friction. This parameter change allows the substrate to perform a dual function: both as the processed object and as the processing tool.
2Manufacturing precision
If multiple processing apparatuses are used to smooth the mounting surface, then the mounting surface becomes smooth when viewed microscopically, but the forms in which the processing tools contact the mounting surface are different from the form in which a wafer contacts the mounting surface, thus the mounting surface is less likely to conform to wafers
Solution Approach 1:
The substrate serves as both the object to be processed and the processing tool. Since the substrate itself smooths the mounting surface, the mounting surface naturally conforms to the substrate's shape and characteristics. This ensures optimal contact and conformity between the mounting surface and subsequent wafers, eliminating the adaptability issues caused by using unrelated processing tools.
3Manufacturing precision
If the mounting surface becomes smooth when viewed microscopically after multiple wafers are processed, then the contact area between wafer and mounting surface increases, but the temperature of wafers becomes inconsistent and processing results cannot be maintained uniform
Solution Approach 1:
The mounting surface is smoothed microscopically before plasma processing begins, using the substrate itself during the heating phase. This preliminary smoothing action ensures consistent contact area and heat transfer characteristics throughout the plasma processing run, preventing temperature variations and maintaining uniform processing results across multiple wafers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method saves time and effort by using the substrate itself to smooth the mounting surface, achieving consistent heat transfer and improved temperature control during plasma processing, thereby maintaining uniform processing results.
Implementation Method 1
plasma is produced in the housing chamber, and the wafer is subjected to the plasma processing by the plasma
Implementation Method 2
an expanding step of thermally expanding the mounted substrate
Implementation Method 3
the substrate and the mounting surface rub against each other, which causes the microscopic roughness of the mounting surface to change
Implementation Method 4
a potential difference arises between the electrostatic electrode plate and a rear surface of the wafer, so that the wafer is attracted to the mounting stage through a Coulomb force
Implementation Method 5
The susceptor has therein a coolant chamber and cools the wafer attracted to the mounting stage using a coolant in the coolant chamber during the plasma processing
Data Source
AI summary
A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.