Component Mounting Apparatus Stroke Compensation
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Solution Overview
Problem
The component mounting apparatus faces defects due to insufficient raising and lowering stroke of the second raising and lowering device, leading to incomplete contact or inadequate load application of components on the target object, especially when there are tolerances or warping issues with the board.
Innovation Solution
The apparatus employs a control device to adjust the target position and perform additional raising and lowering control using the first raising and lowering device when the second device's stroke is insufficient, ensuring the component is properly positioned and loaded on the target object by changing the target position and applying the target load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the second raising and lowering device is used to lower the holding member to the target position, then the component can be mounted on the target object, but the raising and lowering stroke is insufficient when there are tolerances or warping in the board
Solution Approach 1:
The control device performs preliminary action by detecting whether the second raising and lowering device has reached its stroke end before component contact. When stroke insufficiency is detected, the system preemptively adjusts the target position and performs additional lowering control using the first raising and lowering device to ensure adequate contact load is applied, preventing mounting defects before they occur.
2Reliability
If the target position is adjusted to compensate for board height variations, then mounting defects can be prevented, but the control complexity increases
Solution Approach 1:
The control device implements feedback by continuously monitoring the raising and lowering stroke of the second device and detecting stroke end conditions. Based on this feedback, the system dynamically adjusts the target position and determines whether additional lowering control is needed, creating a closed-loop control system that adapts to board height variations and warping while maintaining mounting reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents mounting defects by ensuring accurate contact and sufficient load application, even with varying board heights or warping, by adjusting the target position and stroke of the first raising and lowering device.
Implementation Method 1
a load measuring section configured to measure a load applied to the holding member
Data Source
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AI summary
A component mounting apparatus, when mounting a component held by a suction nozzle on a board, lowers the suction nozzle to target position Z* using a first raising and lowering device (S140, S150), further lowers the suction nozzle using a second raising and lowering device such that the component contacts the board (S160 to S190), and controls the second raising and lowering device such that load F applied to the suction nozzle becomes target load F* to mount the component on the board (S200 to S230). Also, the component mounting apparatus, in a case in which component P does not reach board S (S180), raises the suction nozzle that is still holding component P and corrects target position Z* (S240, S250), then lowers the suction nozzle to the corrected target position Z* using the first raising and lowering device, and further lowers the suction nozzle using the second raising and lowering device to contact the component on board S so as to mount the component.