Electronic Element Mounting Substrate with Perpendicular Carbon Layers
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Solution Overview
Problem
Existing electronic element mounting substrates face challenges in efficiently managing heat dissipation due to uneven thermal conductivity directions, which can lead to reduced reliability and performance of electronic devices.
Innovation Solution
The substrate configuration includes a first substrate with uniform thermal conductivity and two carbon-based substrates with perpendicular high and low heat conduction directions, arranged to distribute heat effectively and enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional insulating substrate with electronic element mounting portions is used, then the device structure is simple, but heat dissipation efficiency is poor due to uneven thermal conductivity directions
Solution Approach 1:
The patent employs a composite substrate structure combining an insulating substrate with two carbon-based substrates having different thermal conductivity orientations. This composite approach enables multi-directional heat dissipation while maintaining electrical insulation, resolving the contradiction between heat dissipation efficiency and structural complexity.
Solution Approach 2:
The heat dissipation function is segmented into two distinct carbon-based substrates with perpendicular thermal conductivity directions. Each substrate handles heat dissipation in its optimized direction, collectively achieving comprehensive thermal management without requiring a single complex isotropic material.
2Temperature
If carbon-based substrates with uniform thermal conductivity are used, then heat dissipation is simplified, but heat accumulation occurs in specific directions
Solution Approach 1:
The patent introduces asymmetry in thermal conductivity by using two carbon-based substrates with perpendicular orientations. This asymmetric configuration ensures heat is dissipated uniformly across all directions rather than concentrating in specific paths, preventing hot spots while maintaining directional heat flow efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation and improved reliability of electronic devices by directing heat in different thermal conductivity directions, preventing heat accumulation and ensuring effective external dissipation.
Implementation Method 1
the second substrate and the third substrate each have a low heat conduction direction in which heat conduction is low, and a high heat conduction direction in which the heat conduction is high
Data Source
AI summary
An electronic element mounting substrate includes: a first substrate including a first principal face; a second substrate located inside the first substrate in a plan view of the electronic element mounting substrate, the second substrate being made of a carbon material; a third substrate located between the first substrate and the second substrate in the plan view, the third substrate being made of a carbon material; and a first mounting portion for mounting a first electronic element, the first mounting portion being located on the first principal face side in a thickness direction of the substrate. The second substrate and the third substrate each have a low heat conduction direction and a high heat conduction direction. The second substrate and the third substrate is arranged so that the low heat conduction directions thereof are perpendicular to each other, and the high heat conduction directions thereof are perpendicular to each other.