Electronic Component Mounting Substrate With Conductive Posts
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Solution Overview
Problem
Existing electronic component mounting substrates face challenges in managing thermal expansion differences between organic and inorganic materials, leading to stress concentration and potential cracking in bumps, which affects mounting reliability.
Innovation Solution
A substrate design featuring a resin support layer with conductive posts, an organic insulation layer with via conductors, and an inorganic insulation layer with fine-pitched pads, where the conductive posts relieve thermal expansion stress and the via conductors facilitate electrical connections between circuits, ensuring reliable mounting and reduced cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a substrate uses both organic and inorganic materials, then functional integration is improved, but thermal expansion stress causes cracking and reduces reliability
Solution Approach 1:
The patent changes the physical state and material parameters by introducing a resin layer with specific mechanical properties between the rigid support substrate and the brittle bump structures. This intermediate layer has different thermal expansion characteristics that bridge the gap between organic and inorganic materials, allowing the substrate to maintain functional integration while reducing thermal stress-induced cracking.
Solution Approach 2:
The patent employs a composite structure consisting of multiple materials: a rigid support substrate, an organic resin layer, and inorganic bump structures. This composite approach allows each material to fulfill its optimal function while the combination mitigates the weaknesses of individual materials, particularly the thermal expansion mismatch that causes cracking in monolithic structures.
2Manufacturing precision
If fine-pitched pads are formed in the inorganic insulation layer, then connection precision is improved, but stress concentration increases leading to cracking
Solution Approach 1:
The patent applies local quality by positioning the resin layer specifically in regions where stress concentration occurs around the fine-pitched pads and bump structures. The resin layer's mechanical properties are optimized for stress distribution in these critical local areas, while other regions maintain their original structural characteristics for precision connections.
3Adaptability or versatility
If multiple layers are added to accommodate fine-pitch terminals, then mounting capability is improved, but device complexity increases
Solution Approach 1:
The resin layer is designed to perform multiple functions simultaneously: it provides mechanical stress relief, enables fine-pitch terminal mounting, and serves as an insulating barrier. This multi-functionality allows the substrate to achieve enhanced mounting capability without proportionally increasing device complexity, as a single layer accomplishes what would otherwise require multiple specialized layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate design effectively relieves thermal expansion-induced stress, enhances mounting reliability, and allows for fine-pitch terminal connections without increasing layer count, improving the overall performance and durability of electronic component mounting.
Implementation Method 1
The support layer has a conductive post formed inside the support layer and electrically connecting the first conductive circuit and the conductor
Implementation Method 2
The organic insulation layer has a via conductor formed inside the organic insulation layer and electrically connecting the second conductive circuit in the inorganic insulation layer and the first conductive circuit
Data Source
AI summary
An electronic component mounting substrate including a support layer made of resin with first and second surfaces, an organic insulation layer on the first surface of the support layer with a first surface on opposite side of the first surface of the support layer and a second surface in contact with the first surface of the support layer, an inorganic insulation layer on the first surface of the organic layer, a conductor on the second surface of the support layer, and a first conductive circuit on the second surface of the organic layer. The inorganic layer has a second conductive circuit and a pad for mounting an electronic component inside the inorganic layer. The organic layer has a via conductor inside the organic layer and connecting the first and second circuits. The support layer has a conductive post inside the support layer and connecting the first circuit and the conductor.