Electronic Mounting Substrate With Anisotropic Heat Dissipation
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Solution Overview
Problem
Existing substrate technologies for mounting electronic elements face challenges in efficient heat dissipation, leading to potential distortion and reduced reliability of electronic devices due to uneven heat transfer and thermal expansion differences between materials.
Innovation Solution
A substrate configuration comprising a first insulating substrate, a metal second substrate, and carbon-based heat dissipation bodies with specific thermal conductivity properties, where the heat dissipation bodies are aligned to enhance perpendicular heat transfer and suppress longitudinal heat transfer, ensuring effective heat dissipation and minimizing distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate mounting is used, then electronic elements can be mounted on the substrate, but heat dissipation efficiency is poor leading to distortion and reduced reliability
Solution Approach 1:
The patent employs a composite substrate structure combining a first substrate, a second substrate, and heat dissipation bodies made of different materials with complementary properties. The first substrate provides mechanical support and electrical insulation, the second substrate offers thermal conductivity, and the heat dissipation bodies enhance heat transfer efficiency. This multi-material composite approach resolves the contradiction by integrating materials that simultaneously provide structural integrity and effective heat dissipation, preventing thermal distortion and improving device reliability.
Solution Approach 2:
The heat dissipation bodies serve as intermediary elements between the electronic elements and the second substrate. These intermediaries facilitate efficient heat transfer from the mounting portions through the second substrate to the heat dissipation bodies, which then conduct heat away from the electronic elements. This intermediary structure resolves the thermal management challenge while maintaining the mechanical and electrical functions of the original substrate system.
2Temperature
If heat dissipation bodies are added to improve heat transfer, then thermal management improves, but substrate structure becomes more complex
Solution Approach 1:
The substrate system is segmented into distinct functional modules: a first substrate for mechanical support and electrical insulation, a second substrate for thermal conduction, and multiple heat dissipation bodies for active heat management. Each segment performs a specific function, allowing the complex thermal management task to be divided into manageable components that can be independently optimized and assembled.
Solution Approach 2:
Heat dissipation bodies are strategically positioned at specific locations corresponding to mounting portions where electronic elements generate heat. This localized approach concentrates heat dissipation capabilities where they are most needed, rather than uniformly distributing thermal management features throughout the entire substrate. The second substrate's thermal conductivity is utilized specifically in regions requiring active heat management, optimizing the balance between thermal performance and structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration improves heat dissipation efficiency, reduces distortion, and enhances the long-term reliability of electronic devices by optimizing heat transfer paths and accommodating thermal expansion differences between materials.
Implementation Method 1
the heat conduction of the plurality of heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is larger than heat conduction of the plurality of heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate
Data Source
AI summary
A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposite to the first surface; a second substrate including a third surface and a fourth surface opposite to the third surface; and heat dissipation bodies each including a fifth surface and a sixth surface opposite to the fifth surface. The first substrate includes at least one mounting portion for at least one electronic element at the first surface. Heat conduction of the heat dissipation bodies in a direction perpendicular to a longitudinal direction of the at least one mounting portion and perpendicular to a direction along opposite sides of the second substrate is greater than heat conduction of the heat dissipation bodies in the longitudinal direction of the at least one mounting portion and in the direction along opposite sides of the second substrate in a transparent plan view of the substrate.