Electronic Device Mounting Substrate Impact Resistance Design
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Solution Overview
Problem
Existing electronic device mounting substrates face challenges in achieving low-profile designs while maintaining impact resistance, as reduced thickness leads to warpage or fracture under stress.
Innovation Solution
The electronic device mounting substrate comprises a first wiring substrate with a rectangular frame, a second wiring substrate overlapping and electrically connected to the first, and a metallic plate sandwiching the second wiring substrate, with a lid body securing the assembly to enhance impact resistance and allow for thinner profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the metallic base body is reduced to achieve low-profile design, then the profile height is reduced, but the wiring substrate becomes susceptible to warpage or fracture under impact stress
Solution Approach 1:
The invention divides the base body into multiple segments: a thin metallic base body (first metallic layer) for low profile, reinforced with a composite reinforcement layer (second metallic layer + resin layer) that acts as a separate structural element. This segmentation allows the base body to remain thin while the reinforcement layer provides impact resistance, preventing warpage or fracture of the wiring substrate under stress.
Solution Approach 2:
The invention uses composite materials by combining a metallic layer with a resin layer to form a reinforcement layer. The resin layer has lower modulus of elasticity than the metallic layer, creating a composite structure that provides both structural support and stress absorption. This composite reinforcement layer prevents warpage or fracture of the wiring substrate while allowing the overall profile height to remain low.
2Length of moving object
If the thickness of the metallic base body is reduced for low-profile design, then the profile height is reduced, but the wiring substrate becomes more prone to warpage under stress
Solution Approach 1:
The base body is segmented into a thin metallic layer and a separate composite reinforcement layer. This segmentation allows the metallic layer to maintain low profile while the reinforcement layer independently provides structural stability, preventing warpage of the wiring substrate through its distributed support structure.
Solution Approach 2:
The invention changes the physical parameters of the reinforcement layer, specifically ensuring its thickness is 0.1 mm or more and its modulus of elasticity is lower than the metallic layer. These parameter changes optimize the reinforcement layer's ability to distribute stress and prevent warpage, maintaining structural stability while keeping the overall profile low.
Data Source
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AI summary
There are provided an electronic device mounting substrate and an electronic apparatus which are capable of enhancement in impact resistance. An electronic device mounting substrate (1) according to one aspect of the invention includes: a first wiring substrate (2) shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole (2a); a second wiring substrate (6) shaped in a rectangular frame or plate, the second wiring substrate (6) being disposed so as to overlie a lower surface of the first wiring substrate (2) and be electrically connected to the first wiring substrate (2), one of outer edges of the second wiring substrate (6) being located more outward than a corresponding one of outer edges of the first wiring substrate (2); a metallic plate (4) disposed so as to overlie a lower surface of the second wiring substrate (6) so that the second wiring substrate (6) is sandwiched between the metallic plate (4) and the first wiring substrate (2), outer edges of the metallic plate (4) being located more outward than the outer edges of the first wiring substrate (2) and more inward than the one of the outer edges of the second wiring substrate (6); and a lens holder (5) which is a lid body secured to an outer periphery of the metallic plate (4), with the one of the outer edges of the second wiring substrate (6) lying in between, so as to cover the first wiring substrate (2) and the second wiring substrate (6). A frame interior of the first wiring substrate (2), or a frame interior of each of the first wiring substrate (2) and the second wiring substrate (6), constitutes an electronic device mounting space (11).