Electronic Component Mounting System with Feedback and Feedforward Correction
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Solution Overview
Problem
Existing electronic component mounting systems are insufficient for substrates that warp or have high difficulty in mounting, leading to positional displacement issues and increased risk of mounting failures, especially in ceramic substrates with fine pitch areas.
Innovation Solution
An electronic component mounting system that includes a screen printing device, inspection device, and mounting devices with feedback and feedforward mechanisms to generate and apply correction data for mask positioning and component coordinates, addressing specific displacement values at different mount positions to prevent positional errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If deviation data based on average positional displacement of all solder sections is fed back, then overall print quality is improved, but mounting failures occur at specific difficult positions such as fine pitch areas and warped substrates
Solution Approach 1:
The patent applies local quality by differentiating the correction approach based on the specific characteristics of each electronic component mount position. The system identifies positions with large positional displacement values and applies enhanced correction measures specifically to those locations, rather than applying uniform correction across all positions. This allows the system to address the specific problems at fine pitch areas and warped substrate regions while maintaining overall print quality.
Solution Approach 2:
The patent segments the electronic component mount positions into different categories based on their displacement characteristics. By dividing the mount positions into those with large displacement values and those with small displacement values, the system can apply different correction strategies to each segment. This segmentation enables targeted correction for problematic areas while preserving the effectiveness of the overall feedback mechanism.
2Manufacturing precision
If positional displacement correction is applied uniformly across all mount positions, then overall displacement is reduced, but specific difficult positions like fine pitch areas still experience mounting failures
Solution Approach 1:
The system implements local quality by applying different correction intensities and methods to different mount positions based on their specific characteristics. Positions with large displacement values receive enhanced correction attention, while positions with small displacement values use standard correction. This differentiated approach ensures that fine pitch areas and warped substrate regions receive the specialized correction they need, preventing mounting failures while maintaining overall precision improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system effectively reduces positional displacement and prevents mounting failures by providing precise corrections for both warped substrates and those with challenging mount positions, ensuring high-quality assembly.
Implementation Method 1
a screen printing device that positions a mask in which a plurality of apertures are formed to the substrate and that forms solder sections on electrodes formed at the plurality of electronic component mount positions on the substrate via the apertures
Implementation Method 2
an inspection device that inspects the substrate on which the solder sections are formed and that generates inspection data including print displacement values of the solder sections at the plurality of electronic component mount positions
Implementation Method 3
a feedback part that generates, based on the inspection data, first information about corrections on control parameters pertinent to positioning of the mask to the substrate in the screen printing device
Implementation Method 4
a feedforward part that generates, based on the inspection data, second information about corrections on electronic component mount coordinates in the electronic component mounting device
Implementation Method 5
an electronic component mounting device that mounts electronic components at the plurality of electronic component mount positions on the substrate having finished undergoing inspection in the inspection device
Data Source
AI summary
An electronic component mounting system includes a screen printing device, an inspection device, an electronic component mounting device, a feedback part that generates, based on inspection data formed by the inspection device, first information about corrections on control parameters pertinent to positioning of a mask to a substrate in the screen printing device, and a feedforward part that generates, based on the inspection data, second information about corrections on electronic component mount coordinates in the electronic component mounting device. The feedback part generates the first information based on the first print displacement value. The feedforward part generates the second information based on the second print displacement value.