Electronic Component Mounting System with Holding State Validation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing electronic component mounting systems face inefficiencies due to human errors in identifier reading, leading to potential misidentification of components, resulting in defective substrates and reduced production yield.
Innovation Solution
The system incorporates a holding state sensor, determination section, and retry count acquisition to validate the holding of electronic components, with a conversion section that adjusts determinations based on remaining component counts and retry thresholds, ensuring accurate component collation and halting operations when necessary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual identifier reading is performed by operators, then the system can identify electronic components, but human errors occur leading to misidentification and defective substrates
Solution Approach 1:
The patent replaces manual identifier reading with an automated reading device that optically reads identifiers on reels and feeders. This substitution eliminates human error in component identification, ensuring accurate matching between components and substrate positions, thereby improving both measurement precision and reliability.
Solution Approach 2:
The system implements feedback mechanisms where the reading device continuously monitors identifier information, the control device compares actual component positions with planned positions, and automatically corrects deviations. This closed-loop feedback ensures high identification accuracy and prevents defective substrates by detecting and correcting errors before they affect production yield.
2Reliability
If the system halts operations when component remaining number is zero, then accurate component collation is ensured, but production efficiency is reduced due to frequent stoppages
Solution Approach 1:
The system performs preliminary actions by detecting when component remaining numbers approach zero and automatically preparing replacement reels or feeders before complete exhaustion. This advance preparation allows seamless substitution of components without halting the mounting operations, maintaining both collation accuracy and production efficiency.
Solution Approach 2:
The control device dynamically adjusts operations based on real-time component remaining numbers. When components are abundant, the system operates at full speed; when remaining numbers approach thresholds, the system automatically manages component substitution. This dynamic adaptation maintains high productivity while ensuring accurate component collation throughout the production process.
3Reliability
If retry attempts are made when holding fails, then component mounting reliability improves, but system complexity increases due to retry count tracking and threshold management
Solution Approach 1:
The system implements a limited number of retry attempts (e.g., up to 3 retries) when holding fails, rather than attempting infinite retries. This partial action approach improves reliability by providing sufficient retry opportunities to overcome transient holding failures, while avoiding excessive complexity by setting a predetermined, manageable retry limit that simplifies control logic and component management.
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The electronic component mounting system of the present invention includes: a supplying device capable of supplying an electronic component; a mounting apparatus that includes a holding member (for removably holding the electronic component) and is capable of mounting the electronic component (of the supplying device) on a substrate by holding the electronic component with the holding member; an identification information acquisition section that acquires identification information (for identifying the electronic component of the supplying device); a normal electronic component information acquisition section that acquires normal electronic component information (corresponding to an electronic component to be mounted on the substrate); a component collation section that collates the identification information with the normal electronic component information (to determine whether or not the electronic component of the supplying device is the electronic component to be mounted on the substrate); a control section that controls the mounting apparatus (on the basis of a determination result of the component collation section); an operating device capable of generating an operation signal for converting a negative determination of the component collation section into a positive determination; a remaining number information acquisition section (that acquires remaining number information corresponding to the remaining number of electronic components in the supplying device); and an invalidation section that invalidates the operating device (on the basis of the remaining number information). According to this electronic component mounting system, a defective substrate is difficult to occur.