Mouse Pad Molding Frames for Variable Coil Thickness
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Solution Overview
Problem
Existing mouse pad manufacturing devices are limited to producing mouse pads with a single specification, leading to high mold and production costs and poor yield due to incomplete coil coverage in products with different specifications.
Innovation Solution
A manufacturing device comprising a first and second frame with adjustable board thickness and a base, allowing for the production of mouse pads with varying coil heights by using interchangeable frames and a base with a mouse pad forming chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single specification manufacturing device is used, then the device structure is simple, but the adaptability to various coil thickness specifications is poor
Solution Approach 1:
The manufacturing device is divided into modular components: a base unit and interchangeable frame units with different board thicknesses. Each frame unit can be independently selected and attached to the base, allowing the device to be segmented and reconfigured for different coil thickness specifications without requiring a completely different device for each specification.
Solution Approach 2:
The base unit is designed with a universal interface that can accommodate multiple types of frame units with different board thicknesses. This universal base structure enables a single device to perform multiple functions by simply changing the frame unit, thereby achieving adaptability to various coil thickness specifications without increasing overall device complexity.
2Manufacturing precision
If separate manufacturing devices are prepared for different specifications, then the manufacturing precision for each specification is high, but the mold and production costs increase
Solution Approach 1:
A single base unit is designed with a universal interface that can accommodate multiple frame units with different board thicknesses. This universal base structure enables one device to serve multiple specifications, eliminating the need for separate manufacturing devices for each coil thickness specification, thereby reducing mold and production costs while maintaining manufacturing precision through the selective use of appropriately thick frames.
Solution Approach 2:
The device allows for parameter changes in board thickness by enabling users to switch between different frame units with varying board thicknesses. This parameter adjustability ensures that the manufacturing precision required for different coil thickness specifications can be maintained without requiring separate dedicated devices, thus reducing overall production costs.
3Device complexity
If shared molds are used for different specifications, then the device complexity is reduced, but the coil coverage becomes incomplete leading to poor yield
Solution Approach 1:
The device is segmented into a base unit and interchangeable frame units, allowing the board thickness parameter to be adjusted by changing frames rather than using a completely shared mold structure. This segmentation enables complete coil coverage for different specifications while keeping the overall device structure relatively simple and manageable.
Solution Approach 2:
The invention implements parameter changes in board thickness through the interchangeable frame units. By changing the board thickness parameter according to the specific coil thickness being manufactured, the device ensures complete and proper coil coverage, thereby improving manufacturing yield while avoiding the complexity of entirely separate devices for each specification.
Data Source
AI summary
A mouse pad manufacturing device includes a first frame, a second frame and a base. The first frame is defined with a board thickness. The second frame is defined with a board thickness. The board thickness of the second frame is less than the board thickness of the first frame. The base has a bottom plate and a surrounding frame extended from the bottom plate. A mouse pad forming chamber is defined between the surrounding frame and the bottom plate. The first frame or the second frame is interchangeably disposed in the mouse pad forming chamber. Accordingly, the manufacturing device is suitable for various coil diameters.