Integrated MOV and Semiconductor Crowbar for Overvoltage Protection

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Solution Overview

Problem

Existing semiconductor devices for overvoltage protection, such as clamping devices and crowbar devices, suffer from slow response times, high leakage currents, and limited durability, making them inadequate for effectively managing transient overvoltage events.

Innovation Solution

An overvoltage protection device integrating a metal oxide varistor (MOV) with a semiconductor crowbar device, where the semiconductor crowbar component acts as a high impedance switch during an off-state, reducing leakage current and providing fast response and durable protection by clamping voltage to a low level when an overvoltage condition is detected.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a clamping device is used for overvoltage protection, then voltage clamping is achieved, but the response time is slow and clamping voltage is high

Engineering Contradiction:
Improveovervoltage protection effectivenessVSAvoidresponse time
Core Design Contradiction:
ReliabilityVSSpeed

Solution Approach 1:

The patent combines a semiconductor crowbar device and a metal oxide varistor (MOV) into a single integrated overvoltage protection device. The semiconductor layers (first through fourth) form a crowbar mechanism that rapidly responds to overvoltage conditions, while the MOV provides robust voltage clamping. This merger resolves the contradiction by achieving both fast response (from the semiconductor crowbar) and effective voltage clamping (from the MOV) simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If a metal oxide varistor is used for overvoltage protection, then voltage clamping is achieved, but leakage current is high and self-heat dissipation accelerates aging

Engineering Contradiction:
Improvevoltage clamping capabilityVSAvoidleakage current
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The integrated device merges the semiconductor crowbar structure with the MOV, where the semiconductor layers provide a low-leakage path during normal operation. The crowbar mechanism remains in high-impedance state during off-state, significantly reducing leakage current compared to a standalone MOV, while the MOV maintains its voltage clamping capability when triggered.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the electrical parameters of the protection device by integrating the semiconductor crowbar, which alters the leakage current characteristics. The semiconductor structure modifies the overall device behavior, reducing the leakage current parameter while maintaining the clamping voltage parameter through the synergistic interaction between the crowbar and MOV components.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If a crowbar device is used for overvoltage protection, then voltage return to lower stage is achieved, but the device does not return to low leakage state without resetting

Engineering Contradiction:
Improvevoltage restoration capabilityVSAvoidautomatic reset capability
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent merges the voltage restoration function of the crowbar device with the automatic reset capability inherent in the semiconductor structure. The semiconductor layers are designed to automatically transition from conducting to blocking state when the overvoltage condition subsides, eliminating the need for manual resetting while maintaining reliable voltage restoration.

Inventive Principle:
Principle #5Merging (Combining)

4Speed

If a semiconductor crowbar device is used, then fast response is achieved, but clamping voltage may be high without proper integration

Engineering Contradiction:
Improveresponse timeVSAvoidclamping voltage level
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent merges the fast-response semiconductor crowbar mechanism with the robust voltage-clamping MOV structure. The semiconductor layers provide rapid detection and initiation of protection, while the MOV ensures the final clamping voltage remains at an appropriate level. This combination resolves the contradiction by achieving both fast response and controlled clamping voltage.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated device achieves low clamping voltage, low leakage, and fast response times, effectively protecting electronic equipment from overvoltage events while maintaining durability and accurate breakover voltage behavior.

Implementation Method 1

voltage may be clamped to a level characteristic of the particular clamping device

Methodology Applied
Scientific EffectVaristor effect: Electrical Resistance

Implementation Method 2

when a certain voltage is reached

Methodology Applied
Scientific EffectBreakdown effect: Avalanche Breakdown

Data Source

PatentEP3335290B1Overvoltage protection device
Publication Date: 2023.02.22 LITTELFUSE SEMICON WUXI
  • EP3335290B1 patent drawingFigure 1A~1B
  • EP3335290B1 patent drawingFigure 2~3B
  • EP3335290B1 patent drawingFigure 4A

AI summary

An overvoltage protection device (100) may include a metal oxide varistor (MOV) (102) having a first surface (114) and a second surface (116); a semiconductor substrate (202) having a first outer surface (126) and a second outer surface (128) and comprising a semiconductor crowbar device (104) comprising a plurality of semiconductor layers arranged in electrical series to one another, the semiconductor substrate (202) being disposed on a first side of the metal oxide varistor (102), a conductive region (124) disposed between the second surface (116) of the MOV (102) and the first outer surface (126) of the semiconductor substrate (202); a first electrical contact (120) disposed on the first surface (114) of the MOV (102); and a second electrical contact (122) disposed on the second outer surface (128) of the semiconductor substrate (202).