Movable Baffle Mechanism for Laptop Heat Exhaust

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Solution Overview

Problem

Portable electronic devices face cooling challenges due to compact designs that limit internal space, leading to insufficient heat dissipation through existing heat exhausting holes, which cannot effectively manage high heat generation from components like CPUs and graphics cards.

Innovation Solution

An electronic device design featuring a baffle mechanism that pivots to expose or cover heat exhausting openings, utilizing a drive mechanism with a pivot, linkage, and sliding member to enhance airflow and cooling efficiency without occupying additional internal space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the electronic device is designed with compact size, then portability and ease of carrying are improved, but internal space is reduced leading to insufficient cooling capability

Engineering Contradiction:
Improvedevice sizeVSAvoidinternal temperature
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The baffle is designed as a movable component that can dynamically adjust its position between covering and exposing the heat exhausting opening. When the laptop lid is closed, the baffle covers the opening to maintain compact appearance. When the lid is opened, the baffle automatically moves to expose the opening, increasing the cooling area and airflow without requiring additional internal space.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The invention utilizes the third dimension (vertical space created by opening the lid) to enable the baffle to move and expose the cooling opening. By leveraging the lid opening motion, the system creates additional space for heat dissipation without increasing the footprint or internal volume of the device body.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If heat exhausting holes are set up on the bottom surface, then heat dissipation is improved, but the number and area of holes are limited and insufficient for high performance devices

Engineering Contradiction:
Improveheat dissipationVSAvoidcooling opening area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The baffle acts as a dynamic control element that can switch the state of the cooling opening from covered to exposed. This allows the system to access a much larger cooling area (the entire bottom surface opening) on demand, rather than being limited to small fixed holes, while maintaining device integrity when closed.

Inventive Principle:
Principle #15Dynamics

3Temperature

If pads are set up on the bottom to raise the device, then a gap is created for heat exhausting holes, but the device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The movable baffle mechanism serves multiple functions: it controls the exposure of the heat exhausting opening, maintains device appearance when closed, and enables enhanced cooling when open. This single mechanism replaces the need for separate pads and fixed small holes, reducing overall structural complexity while achieving better cooling performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The baffle mechanism effectively increases cooling space and airflow, reducing operating temperatures of electronic components while maintaining the compactness of portable devices, thus addressing the insufficiency of traditional heat dissipation methods.

Implementation Method 1

expose at least part of the opening on the bottom surface, so as to increase the cooling space under the electronic devices and enhance the internal airflow circulating

Methodology Applied
Scientific EffectAirflow: Convection

Data Source

PatentUS9201475B2Electronic device including a movable baffle to enhance cooling
Publication Date: 2015.12.01 GIGA BYTE TECH CO LTD
  • US9201475B2 patent drawing
  • US9201475B2 patent drawing
  • US9201475B2 patent drawing

AI summary

An electronic device includes a first body, a second body, a baffle and a drive mechanism. The second body includes an opening the bottom surface thereof, and the baffle is disposed on the bottom surface to cover the opening. The baffle moves with respect to the second body and has a raised portion. The drive mechanism includes a pivot, a linkage and a sliding member. The pivot connects the first body and the second body. The linkage is sleeved over the pivot. The sliding member is connected to the linkage and has a pushing portion. While the first body rotates with respect to the second body, the pivot rotates with the first body and drives the linkage to push the sliding member. In the meantime, the sliding member displaces to push the raised portion by the pushing portion, so that the baffle moves and exposes part of the opening.