Movable Baseplate Linkage Mechanism for Thermal Management
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Solution Overview
Problem
The compact size of modern electronic devices hampers heat dissipation efficiency due to reduced convection space, as they generate more heat with advancements in performance and miniaturization.
Innovation Solution
An electronic device design featuring a pivotally connected baseplate that can be selectively moved away from the top surface to form an opening, enhancing heat convection between internal components and external air through a linkage and push member mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic device is made compact and miniaturized, then the device size is reduced and portability is improved, but the heat dissipation efficiency deteriorates due to reduced convection space
Solution Approach 1:
The baseplate is designed as a movable component that can dynamically change position between covering and uncovering the opening. The linkage mechanism converts the pushing motion into rotational movement of the baseplate, enabling dynamic adjustment of the heat dissipation opening area based on operational requirements
Solution Approach 2:
The housing is segmented into a fixed base and a movable baseplate that can be independently positioned. This segmentation allows the baseplate to be moved away from the top surface to form an opening, creating a dedicated heat dissipation pathway without affecting the overall compact structure of the device
2Temperature
If a movable baseplate mechanism is added to enable heat dissipation, then heat convection is improved, but the device complexity increases due to additional linkage and pushing components
Solution Approach 1:
The baseplate serves multiple functions: it acts as part of the housing structure, provides a mounting surface for components, and functions as a movable cover for the heat dissipation opening. The linkage mechanism also serves dual purposes by both enabling baseplate movement and potentially acting as a structural support element
Solution Approach 2:
The linkage mechanism and pushing members are disposed within the base structure, nesting the actuation components inside the existing housing volume. This eliminates the need for external actuators or additional space for the mechanism, integrating the complexity within the already-designed structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation by creating a convection pathway between internal heat sources and external air, effectively managing thermal loads in compact electronic devices.
Implementation Method 1
heat convection between heat components of the electronic device and external air is improved
Data Source
AI summary
An electronic device, comprises: a base including a top surface and a bottom surface; a baseplate, a side edge of the baseplate is pivotally connected with the bottom surface, a moving member disposed in the base and configured to push against the baseplate; a linkage member disposed in the base and configured to push against the moving member; and a push member disposed in the base, the push member makes the baseplate moved via the linkage member and the moving member in sequence to make the baseplate selectively cover the bottom surface or detached from the bottom surface.