Movable Block Resin Molding Apparatus for Void Prevention
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Solution Overview
Problem
The existing resin molding apparatus requires different compression springs with specific urging forces for various resin molded products, leading to inefficient production and potential damage from high load when opening the mold die, necessitating a solution for improved accuracy and simplicity in resin molding.
Innovation Solution
A resin molding apparatus with a mold die and mold clamp mechanism, featuring a movable block that narrows the internal flow path using a fluid-driven mechanism, allowing controlled resin flow and adjustable driving force to prevent voids and enhance molding accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If compression springs with large urging force are used to move the upper die cavity piece, then the molding accuracy is improved, but the load on the resin increases causing damage to the resin molded product
Solution Approach 1:
The patent applies a movable block that can dynamically adjust its position to narrow the internal flow path during resin molding. This dynamic adjustment allows the system to achieve precise molding control without requiring large compression spring forces, thereby preventing damage to the resin molded product while maintaining high molding accuracy.
Solution Approach 2:
The patent changes the physical state and position parameters of the movable block during the molding process. By adjusting the block's position to narrow the flow path at critical moments, the system achieves precise control over resin flow without applying excessive force, thus resolving the contradiction between molding accuracy and product damage.
2Adaptability or versatility
If different compression springs with different urging forces are prepared for various resin molded products, then the adaptability is improved, but the device complexity increases
Solution Approach 1:
The patent employs a single movable block that can be adjusted to different positions and configurations to suit various resin molded products. This universal component replaces the need for multiple specialized compression springs, achieving adaptability across different product types while maintaining simple device complexity.
Solution Approach 2:
The movable block's dynamic adjustability allows it to adapt to different molding requirements without requiring changes to the compression spring configuration. This dynamic capability provides versatility for various resin molded products while keeping the overall device structure simple and manageable.
3Manufacturing precision
If the upper die cavity piece is raised gradually to complete filling the cavity with molten resin, then the manufacturing precision is improved, but the time required for molding increases
Solution Approach 1:
The movable block is positioned in advance to narrow the internal flow path before resin injection. This preliminary action ensures that the resin flows uniformly and fills the cavity efficiently without requiring gradual raising of the upper die cavity piece, thus achieving high molding precision while reducing the overall molding time.
Solution Approach 2:
The patent changes the flow path parameters by positioning the movable block to narrow the internal flow path at critical moments during resin injection. This parameter adjustment enables uniform resin distribution and complete cavity filling without time-consuming gradual raising operations, balancing precision and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved accuracy in resin molding by ensuring uniform resin flow and preventing air entrapment, resulting in higher quality resin molded products with a simpler configuration.
Implementation Method 1
a driving mechanism configured to drive the movable block with use of a fluid
Data Source
AI summary
A resin molding apparatus includes: a mold die that is configured to hold an object to be molded, the object including a substrate and a chip on the substrate, and that has a cavity configured to receive a resin material through a gate; a mold clamp mechanism configured to clamp the mold die; and a control section configured to control how the mold die and the mold clamp mechanism are operated, the mold die including: a movable block configured to narrow at least a portion of an internal flow path of the cavity in which internal flow path the chip is not disposed; and a driving mechanism configured to drive the movable block with use of a fluid, the control section being configured to change a driving force of the driving mechanism during resin-molding of the object.