Movable Bond Head for Die Protrusion and Void-Free Bonding
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Solution Overview
Problem
The challenge in three-dimensional semiconductor devices is the formation of air pockets or bubbles during the bonding process of semiconductor IC dies to target substrates, leading to poor bonding and reduced device yields due to mechanical deformations and void areas.
Innovation Solution
A die bonding tool with a bond head featuring a moveable component that can be extended to impart a concave shape to the semiconductor IC die, followed by retraction to flatten it, is used to control the shape and deformation of the die during bonding, thereby mitigating the formation of air pockets and ensuring a smooth bonding wave propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bonding process is used to bond semiconductor IC dies to target substrates, then the bonding process is simple and fast, but air pockets or bubbles form during bonding leading to poor bonding quality and reduced device yields
Solution Approach 1:
The die is pre-shaped into a concave configuration before the bonding process using a molding apparatus. This preliminary shaping action prepares the die to accommodate the bonding wave propagation, preventing air pocket formation during subsequent bonding operations without modifying the bonding process itself
Solution Approach 2:
The invention introduces a dynamic molding apparatus with movable components that can adjust and release the die shape. The die transitions from a concave molded state during bonding to a flat state after bonding, allowing the system to adapt its configuration based on the bonding stage
2Reliability
If the die shape is modified during bonding to prevent air pockets, then bonding quality improves, but the bonding process becomes more complex and time-consuming
Solution Approach 1:
The die is pre-shaped into a concave configuration before the bonding process using a molding apparatus. This preliminary shaping action prepares the die to accommodate the bonding wave propagation, preventing air pocket formation during subsequent bonding operations without modifying the bonding process itself
Solution Approach 2:
The molding apparatus applies shape modification only during the bonding operation, then releases the die to return to its flat state. This periodic application of shaping during the bonding window minimizes additional time while ensuring quality
3Manufacturing precision
If a movable component is added to the bond head to control die shape, then die protrusion control improves and air pockets are prevented, but the device complexity increases
Solution Approach 1:
The invention introduces a dynamic molding apparatus with movable components that can adjust and release the die shape. The die transitions from a concave molded state during bonding to a flat state after bonding, allowing the system to adapt its configuration based on the bonding stage
Solution Approach 2:
The molding apparatus acts as an intermediary between the die and the bonding process. It temporarily modifies the die shape during bonding to prevent air pockets, then releases the die without requiring permanent modifications to either the die or bonding equipment
Data Source
AI summary
A die bonding tool includes a bond head having a moveable component. The moveable component may be moveable between an extended position in which a lower surface of the moveable component protrudes below a lower surface of the bond head and a retracted position in which the lower surface of the moveable component does not protrude below the lower surface of the bond head. The moveable component may be used to control a shape of a semiconductor die secured to the lower surface of the bond head during a process of bonding the semiconductor die to a substrate. Accordingly, void areas and other bonding defects may be avoided and the bond formed between the semiconductor die and the target substrate may be improved.